EP1M350F780C7ES vs EP1M350F780C7 तुलना
विस्तृत दोनों ओर की तुलना EP1M350F780C7ES द्वारा Intel और EP1M350F780C7 द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
विशेषता तुलना
| पैरामीटर | EP1M350F780C7ES | EP1M350F780C7 |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | सक्रिय | NRND |
| Product Type | Field Programmable Gate Array (FPGA) | — |
| Logic Family | CMOS | CMOS |
| User I/O Count | 486 pins | — |
| Total Package Pins | 780 pins | — |
| Package Type | FINE LINE BGA-780 | FINE LINE BGA-780 |
| Package Category | 780-BBGA | — |
| सप्लाई वोल्टेज | 1.8 V | — |
| Maximum Stated Transceiver Data Rate | 1.25 Gbps | — |
| Channels Supported at 1.25 Gbps | 8 channels | — |
| Remaining Channel Limit | 10 channels at 1.0 Gbps or less | — |
| ऑपरेटिंग तापमान | 0 C to 85 C | 0 C to 85 C (Commercial) |
| Clock Data Recovery | Supported | — |
| High-Speed Transceivers | Integrated | — |
| माउंटिंग प्रकार | Surface Mount | Surface Mount |
| RoHS स्थिति | unknown | [DATA_NEEDED: rohs status] |
| REACH Status | unknown | — |
| Logic Element Count | [DATA_NEEDED: logic element count] | — |
| Embedded Memory Capacity | [DATA_NEEDED: embedded memory capacity] | — |
| Transceiver Count | [DATA_NEEDED: transceiver count] | — |
| Package Dimensions | [DATA_NEEDED: package dimensions] | — |
| थर्मल रेज़िस्टेंस | [DATA_NEEDED: junction-to-ambient thermal resistance] | — |
| Family | — | Mercury (PLD) |
| Device Logic Elements | — | [DATA_NEEDED: exact LE count] |
| Logic Array Blocks (LABs) | — | 1440 |
| System Gates | — | 350,000 |
| Maximum User I/Os | — | 486 |
| पैकेज | — | 780-ball FineLine BGA (F780) |
| Supply Voltage (Core) | — | 1.8 V |
| Transceivers / CDR Support | — | Up to 1.25 Gbps with CDR |
| Configuration Method | — | JTAG / Quartus II |
| MSL स्तर | — | [DATA_NEEDED: MSL rating] |
| Process Technology | — | CMOS SRAM-based |