EP1M350F780C7ES vs EP1M350F780C7 比較
詳細並排比較 EP1M350F780C7ES 由 Intel 與 EP1M350F780C7 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP1M350F780C7ES | EP1M350F780C7 |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | NRND |
| Product Type | Field Programmable Gate Array (FPGA) | — |
| Logic Family | CMOS | CMOS |
| User I/O Count | 486 pins | — |
| Total Package Pins | 780 pins | — |
| Package Type | FINE LINE BGA-780 | FINE LINE BGA-780 |
| Package Category | 780-BBGA | — |
| 供應電壓 | 1.8 V | — |
| Maximum Stated Transceiver Data Rate | 1.25 Gbps | — |
| Channels Supported at 1.25 Gbps | 8 channels | — |
| Remaining Channel Limit | 10 channels at 1.0 Gbps or less | — |
| 工作溫度 | 0 C to 85 C | 0 C to 85 C (Commercial) |
| Clock Data Recovery | Supported | — |
| High-Speed Transceivers | Integrated | — |
| 安裝類型 | Surface Mount | Surface Mount |
| RoHS 狀態 | unknown | [DATA_NEEDED: rohs status] |
| REACH Status | unknown | — |
| Logic Element Count | [DATA_NEEDED: logic element count] | — |
| Embedded Memory Capacity | [DATA_NEEDED: embedded memory capacity] | — |
| Transceiver Count | [DATA_NEEDED: transceiver count] | — |
| Package Dimensions | [DATA_NEEDED: package dimensions] | — |
| 熱阻 | [DATA_NEEDED: junction-to-ambient thermal resistance] | — |
| Family | — | Mercury (PLD) |
| Device Logic Elements | — | [DATA_NEEDED: exact LE count] |
| Logic Array Blocks (LABs) | — | 1440 |
| System Gates | — | 350,000 |
| Maximum User I/Os | — | 486 |
| 封裝 | — | 780-ball FineLine BGA (F780) |
| Supply Voltage (Core) | — | 1.8 V |
| Transceivers / CDR Support | — | Up to 1.25 Gbps with CDR |
| Configuration Method | — | JTAG / Quartus II |
| MSL 等級 | — | [DATA_NEEDED: MSL rating] |
| Process Technology | — | CMOS SRAM-based |