EP20K100FC324-3 vs EP20K100EFC324-2X तुलना
विस्तृत दोनों ओर की तुलना EP20K100FC324-3 द्वारा Intel और EP20K100EFC324-2X द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
विशेषता तुलना
| पैरामीटर | EP20K100FC324-3 | EP20K100EFC324-2X |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | Obsolete | NRND |
| Series | APEX 20K | — |
| Family | APEX 20K (non-KE) | APEX 20KE |
| System Gates | 100,000 | 100,000 gates |
| Logic Elements | 4,160 | — |
| Maximum Logic Blocks | 26 | — |
| Embedded Memory (RAM bits) | 53,248 | — |
| User I/O Pins | 252 | — |
| Total RAM bits | 53,248 | — |
| Process Technology | 0.22 µm CMOS | 0.22 µm CMOS (all-layer copper metal) |
| Core Supply Voltage | 2.5 V | — |
| Maximum Internal Frequency | 167 MHz | — |
| Propagation Delay | 1.6 ns | 1.6 ns |
| Speed Grade | -3 (slowest) | -2X |
| पैकेज | 324-pin FBGA (Fine-pitch BGA) | 324-ball FBGA (FineLine BGA), 19x19 mm, 1.27 mm pitch |
| Package Body Size | 45 x 45 mm | — |
| Ball Pitch | 1.27 mm | — |
| ऑपरेटिंग तापमान | 0 °C to 85 °C (Commercial) | 0 °C to 85 °C (Commercial) |
| Programming Interface | IEEE 1149.1 JTAG | IEEE 1149.1 JTAG |
| माउंटिंग प्रकार | Surface Mount | Surface Mount |
| RoHS स्थिति | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: confirm against lot-specific documentation] |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Device Type | — | SPLD / FPGA (Field Programmable Gate Array) |
| Logic Elements / Cells | — | 4,160 |
| Total RAM Bits | — | 53,248 bits |
| LABs / CLBs | — | 416 |
| Maximum User I/Os | — | 246 |
| Number of I/O Banks | — | 8 (per APEX 20KE family) |
| Internal Operating Frequency | — | Up to 250 MHz |
| Core Supply Voltage (VCCINT) | — | 1.8 V |
| I/O Supply Voltage (VCCIO) | — | MultiVolt: 1.8 V / 2.5 V / 3.3 V |
| Configuration Modes | — | Passive Serial, Passive Parallel, JTAG, Altera configuration EPROM |