EP2AGX190FF35I3G vs EP2AGX260FF35I3G तुलना
विस्तृत दोनों ओर की तुलना EP2AGX190FF35I3G द्वारा Altera और EP2AGX260FF35I3G द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
विशेषता तुलना
| पैरामीटर | EP2AGX190FF35I3G | EP2AGX260FF35I3G |
|---|---|---|
| ब्रांड | Altera | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | अंतिम बार खरीदें | अंतिम बार खरीदें |
| Family | Arria II GX | — |
| Logic Elements (LE) | 181,165 | — |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | — |
| User I/O Pins | 612 | — |
| Embedded Memory (bits) | 10,177,536 | — |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Transceivers | 8 high-speed transceiver channels (multi-gigabit) | [DATA_NEEDED: number of transceiver channels] |
| Embedded Multipliers | [DATA_NEEDED: 18x18 multiplier count] | — |
| PLLs | [DATA_NEEDED: PLL count] | — |
| Core Voltage | 0.9 V | — |
| I/O Voltage Standards | 1.2 V to 3.3 V (LVTTL, LVCMOS, LVDS, HSTL, SSTL) | — |
| Process Node | 40 nm | — |
| ऑपरेटिंग तापमान | -40 °C to +100 °C (industrial, suffix I) | -40 C to +100 C (Industrial) |
| Speed Grade | 3 | I3 |
| पैकेज | 1152-ball FC-FBGA (FF35), 35 mm body | 1152-BBGA, FCBGA |
| Ball Pitch | [DATA_NEEDED: 1.0 mm (typical for FF35)] | — |
| माउंटिंग प्रकार | Surface Mount (flip-chip BGA) | Surface Mount |
| RoHS स्थिति | Compliant (suffix G) | — |
| Lead-Free | Yes | — |
| Programming Toolchain | Quartus II / Quartus Prime | — |
| Device Family | — | Arria II GX |
| Logic Elements | — | 244188 |
| Embedded Memory Bits | — | 12038144 |
| Maximum User I/O | — | 612 |
| Process Technology | — | 40 nm |
| Core Supply Voltage | — | 0.9 V |
| Configuration | — | JTAG / Active Serial / Passive Serial / FPP |
| DSP Blocks | — | [DATA_NEEDED: DSP block count] |
| Lead-Free (RoHS) | — | Yes (G suffix indicates Pb-free finish) |
| Tray Standard Quantity | — | [DATA_NEEDED: tray qty] |