EP2AGX65DF25I6N vs EP2AGX65DF25I3N तुलना
विस्तृत दोनों ओर की तुलना EP2AGX65DF25I6N द्वारा Altera और EP2AGX65DF25I3N द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
Intel
EP2AGX65DF25I3N - Arria II GX FPGA, 60K LE, 252 I/O, 572-FCBGA | Intel
EP2AGX65DF25I3N ⚠ अंतिम खरीदविशेषता तुलना
| पैरामीटर | EP2AGX65DF25I6N | EP2AGX65DF25I3N |
|---|---|---|
| ब्रांड | Altera | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | सक्रिय | अंतिम बार खरीदें |
| Device Family | Arria II GX | — |
| Logic Elements (LE) | 60,214 | — |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory (bits) | 5,371,904 | — |
| Embedded 18x18 Multipliers | 252 | — |
| High-Speed Transceivers | 8 | — |
| Transceiver Data Rate | 600 Mbps to 6.375 Gbps | — |
| PCIe Hard IP Blocks | 4 | — |
| PLLs | 4 | — |
| Global Clock Networks | 12 | — |
| User I/O Banks | [DATA_NEEDED: bank count] | — |
| Maximum User I/O | [DATA_NEEDED: max user I/O] | — |
| Core Supply Voltage | 0.9 V | — |
| ऑपरेटिंग तापमान | -40C to +100C (Industrial) | — |
| Speed Grade | 6 | — |
| पैकेज | 572-ball FCBGA | 572-ball FCBGA (flip-chip BGA) |
| Process Technology | 65 nm | 40 nm TSMC |
| माउंटिंग प्रकार | Surface Mount | — |
| RoHS स्थिति | Compliant | Compliant |
| Family | — | Arria II GX |
| Logic Elements | — | 60,214 |
| Logic Array Blocks (LABs) | — | 2,530 |
| Total Embedded Memory | — | 2,531 Kbits |
| M9K Memory Blocks | — | 4.4 Mbits (approx 488 blocks) |
| MLAB Memory | — | 1.4 Mbits |
| Embedded Multipliers (18x18) | — | [DATA_NEEDED: 18x18 multiplier count] |
| Transceivers | — | 8 channels |
| Max Transceiver Data Rate | — | 6.375 Gbps |
| User I/O Count | — | 252 |
| Core Voltage | — | 0.9 V |
| Operating Temperature Grade | — | Industrial (-40C to +100C ambient) |
| Configuration Modes | — | AS, PS, FPP, JTAG |
| Hard IP for PCIe | — | PCIe Gen1 / Gen2 (x1/x2/x4) |
| Lead-Free | — | Yes |