EP2AGZ225FF35I3G vs EP2AGX190FF35I3G तुलना
विस्तृत दोनों ओर की तुलना EP2AGZ225FF35I3G द्वारा Intel और EP2AGX190FF35I3G द्वारा Altera. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
विशेषता तुलना
| पैरामीटर | EP2AGZ225FF35I3G | EP2AGX190FF35I3G |
|---|---|---|
| ब्रांड | Intel | Altera |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | सक्रिय | अंतिम बार खरीदें |
| Manufacturer | Intel (formerly Altera) | — |
| Series | Arria II GZ | — |
| Device Family | EP2AGZ | — |
| Logic Elements | 225,000 | — |
| पैकेज | 1152-BGA (FBGA, FineLine BGA) | 1152-ball FC-FBGA (FF35), 35 mm body |
| User I/O | 554 | — |
| Transceivers | 12 channels | 8 high-speed transceiver channels (multi-gigabit) |
| Max Transceiver Data Rate | 6.375 Gbps | — |
| Embedded Memory | 17.4 Mbits | — |
| On-chip RAM | 1,152 Kbits | — |
| Embedded Multipliers | 1,728 18x18 | [DATA_NEEDED: 18x18 multiplier count] |
| PLLs | 8 | [DATA_NEEDED: PLL count] |
| DLLs | 8 | — |
| Process Technology | 40 nm TSMC | — |
| Core Voltage | 0.9 V | 0.9 V |
| ऑपरेटिंग तापमान | -40C to +100C (Industrial) | -40 °C to +100 °C (industrial, suffix I) |
| Speed Grade | I3 | 3 |
| माउंटिंग प्रकार | Surface Mount | Surface Mount (flip-chip BGA) |
| Packaging | Tray | — |
| RoHS स्थिति | Compliant | Compliant (suffix G) |
| Family | — | Arria II GX |
| Logic Elements (LE) | — | 181,165 |
| Adaptive Logic Modules (ALM) | — | [DATA_NEEDED: ALM count] |
| User I/O Pins | — | 612 |
| Embedded Memory (bits) | — | 10,177,536 |
| Number of I/O Banks | — | [DATA_NEEDED: number of I/O banks] |
| I/O Voltage Standards | — | 1.2 V to 3.3 V (LVTTL, LVCMOS, LVDS, HSTL, SSTL) |
| Process Node | — | 40 nm |
| Ball Pitch | — | [DATA_NEEDED: 1.0 mm (typical for FF35)] |
| Lead-Free | — | Yes |
| Programming Toolchain | — | Quartus II / Quartus Prime |