EP2S130F1020I4 vs EP2S130F1020C3NGA तुलना
विस्तृत दोनों ओर की तुलना EP2S130F1020I4 द्वारा Intel और EP2S130F1020C3NGA द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
विशेषता तुलना
| पैरामीटर | EP2S130F1020I4 | EP2S130F1020C3NGA |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | Obsolete | NRND |
| Family | Stratix II | Stratix II |
| Logic Elements | 132,540 | — |
| Equivalent LEs | ~180,000 | — |
| Adaptive Logic Modules (ALMs) | 53,016 | — |
| Embedded Memory (bits) | 6,747,840 | — |
| Embedded Memory (M512 blocks) | 530 | — |
| Embedded Memory (M4K blocks) | 768 | — |
| Embedded Memory (M-RAM blocks) | 4 | — |
| Embedded 18x18 Multipliers | 504 | — |
| DSP Blocks | 48 | — |
| User I/O Pins | 742 | — |
| User I/O Banks | 12 | — |
| पैकेज | 1020-ball FC-FBGA (33x33 mm) | 1020-ball FC-FBGA |
| Process Node | 90 nm CMOS, all-layer copper | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| Speed Grade | I (industrial performance) | C3 |
| Device Revision | 4 | — |
| ऑपरेटिंग जंक्शन तापमान | -40C to +100C (industrial) | — |
| Configuration Scheme | Fast Passive Parallel x8, Passive Serial, JTAG | — |
| माउंटिंग प्रकार | Surface Mount (FC-FBGA) | — |
| RoHS स्थिति | Compliant (per distributor listings) | [DATA_NEEDED: rohs status] |
| Logic Elements (LE) | — | 132,540 |
| Logic Array Blocks (LABs) | — | 6,627 |
| Embedded Memory (TriMatrix) | — | 6,747,840 bits (6.7 Mbits) |
| Embedded DSP Blocks | — | Yes (18x18 multiplier blocks) |
| User I/Os | — | 742 |
| Process Technology | — | 90 nm |
| Core Voltage | — | 1.2 V |
| Maximum Internal Clock Frequency | — | 778.82 MHz |
| Temperature Grade | — | Commercial (0C to +85C) |
| PLLs | — | 12 (8 fast PLLs + 4 enhanced PLLs) |
| Configuration Modes | — | PS, PPS, PPA, JTAG |
| Configuration Encryption | — | 128-bit AES |
| On-chip Termination (OCT) | — | Yes (series, parallel, dynamic) |