EP2S130F1020I4 vs EP2S130F1020C3NGA 比較
詳細並排比較 EP2S130F1020I4 由 Intel 與 EP2S130F1020C3NGA 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP2S130F1020I4 | EP2S130F1020C3NGA |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | Obsolete | NRND |
| Family | Stratix II | Stratix II |
| Logic Elements | 132,540 | — |
| Equivalent LEs | ~180,000 | — |
| Adaptive Logic Modules (ALMs) | 53,016 | — |
| Embedded Memory (bits) | 6,747,840 | — |
| Embedded Memory (M512 blocks) | 530 | — |
| Embedded Memory (M4K blocks) | 768 | — |
| Embedded Memory (M-RAM blocks) | 4 | — |
| Embedded 18x18 Multipliers | 504 | — |
| DSP Blocks | 48 | — |
| User I/O Pins | 742 | — |
| User I/O Banks | 12 | — |
| 封裝 | 1020-ball FC-FBGA (33x33 mm) | 1020-ball FC-FBGA |
| Process Node | 90 nm CMOS, all-layer copper | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| Speed Grade | I (industrial performance) | C3 |
| Device Revision | 4 | — |
| 工作接面溫度 | -40C to +100C (industrial) | — |
| Configuration Scheme | Fast Passive Parallel x8, Passive Serial, JTAG | — |
| 安裝類型 | Surface Mount (FC-FBGA) | — |
| RoHS 狀態 | Compliant (per distributor listings) | [DATA_NEEDED: rohs status] |
| Logic Elements (LE) | — | 132,540 |
| Logic Array Blocks (LABs) | — | 6,627 |
| Embedded Memory (TriMatrix) | — | 6,747,840 bits (6.7 Mbits) |
| Embedded DSP Blocks | — | Yes (18x18 multiplier blocks) |
| User I/Os | — | 742 |
| Process Technology | — | 90 nm |
| Core Voltage | — | 1.2 V |
| Maximum Internal Clock Frequency | — | 778.82 MHz |
| Temperature Grade | — | Commercial (0C to +85C) |
| PLLs | — | 12 (8 fast PLLs + 4 enhanced PLLs) |
| Configuration Modes | — | PS, PPS, PPA, JTAG |
| Configuration Encryption | — | 128-bit AES |
| On-chip Termination (OCT) | — | Yes (series, parallel, dynamic) |