EP3SL70F780C2 vs EP3SL70F780C2G तुलना
विस्तृत दोनों ओर की तुलना EP3SL70F780C2 द्वारा Intel और EP3SL70F780C2G द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
विशेषता तुलना
| पैरामीटर | EP3SL70F780C2 | EP3SL70F780C2G |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | सक्रिय | NRND |
| Family | Stratix III L | Stratix III L |
| Series | Stratix III | — |
| Logic Elements | 67,500 | 67,500 |
| Embedded Memory | 2,699,264 bits | 2,699,264 bits |
| Logic Array Blocks (LABs) | 2,700 | — |
| User I/Os | 488 | — |
| Process Technology | 65 nm | — |
| Core Voltage | 1.1 V | — |
| Maximum Operating Frequency | [DATA_NEEDED: max frequency] | — |
| Package Type | 780-BBGA, FCBGA (FineLine BGA) | — |
| Number of Pins/Terminals | 780 | — |
| माउंटिंग प्रकार | Surface Mount | Surface Mount (BGA) |
| Operating Temperature Grade | Commercial (0C to +85C, inferred from C2 suffix) | — |
| RoHS स्थिति | Compliant | Compliant |
| Lead-Free | Yes | — |
| Speed Grade | C2 (inferred from part suffix) | C2 (medium) |
| In-System Programmability | Yes (Quartus II) | — |
| User I/O Count | — | 488 |
| पैकेज | — | 780-ball FCBGA (FineLine BGA) |
| Temperature Grade | — | Commercial (0 C to 85 C) |
| Process Node | — | 40 nm low-power CMOS |
| Core Voltage (VCC) | — | 0.9 V |
| DSP Blocks | — | Yes (dedicated) |
| Memory Interfaces Supported | — | DDR3, DDR2, QDR II+, RLDRAM II |
| PCIe Hard IP | — | Gen1/Gen2 |
| Transceivers | — | [DATA_NEEDED: transceiver count and data rate] |
| PLLs | — | Fractional PLLs |