EP3SL70F780C2 vs EP3SL70F780C2G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SL70F780C2 disebabkan oleh Intel dan EP3SL70F780C2G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3SL70F780C2 | EP3SL70F780C2G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | NRND |
| Family | Stratix III L | Stratix III L |
| Series | Stratix III | — |
| Logic Elements | 67,500 | 67,500 |
| Embedded Memory | 2,699,264 bits | 2,699,264 bits |
| Logic Array Blocks (LABs) | 2,700 | — |
| User I/Os | 488 | — |
| Process Technology | 65 nm | — |
| Core Voltage | 1.1 V | — |
| Maximum Operating Frequency | [DATA_NEEDED: max frequency] | — |
| Package Type | 780-BBGA, FCBGA (FineLine BGA) | — |
| Number of Pins/Terminals | 780 | — |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Operating Temperature Grade | Commercial (0C to +85C, inferred from C2 suffix) | — |
| Status RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Speed Grade | C2 (inferred from part suffix) | C2 (medium) |
| In-System Programmability | Yes (Quartus II) | — |
| User I/O Count | — | 488 |
| Kemasan | — | 780-ball FCBGA (FineLine BGA) |
| Temperature Grade | — | Commercial (0 C to 85 C) |
| Process Node | — | 40 nm low-power CMOS |
| Core Voltage (VCC) | — | 0.9 V |
| DSP Blocks | — | Yes (dedicated) |
| Memory Interfaces Supported | — | DDR3, DDR2, QDR II+, RLDRAM II |
| PCIe Hard IP | — | Gen1/Gen2 |
| Transceivers | — | [DATA_NEEDED: transceiver count and data rate] |
| PLLs | — | Fractional PLLs |