EP4SGX70HF35I3G vs EP4SGX70DF29I3G तुलना
विस्तृत दोनों ओर की तुलना EP4SGX70HF35I3G द्वारा Intel और EP4SGX70DF29I3G द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
विशेषता तुलना
| पैरामीटर | EP4SGX70HF35I3G | EP4SGX70DF29I3G |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | NRND | सक्रिय |
| Series | Stratix IV GX | Stratix IV GX |
| Logic Elements | 72,600 LE | — |
| Adaptive Logic Modules (ALMs) | 29,040 ALM | — |
| Embedded Memory | 7.20 Mbit (7,564,880 bits) | — |
| User I/Os | 480 | — |
| Transceivers | 9 channels up to 8.5 Gbps (GX) | — |
| 18x18 Multipliers | 488 | — |
| PLLs | 4 per quadrant | — |
| Process Technology | 40 nm TSMC | 40 nm |
| Core Supply Voltage | 950 mV | 0.87 V to 0.93 V |
| ऑपरेटिंग तापमान | -40C to +100C (Industrial) | — |
| Speed Grade | I3 | -3 |
| पैकेज | 1152-ball FCBGA, 35x35 mm, 1.0 mm pitch | — |
| माउंटिंग प्रकार | Surface Mount (Flip-Chip BGA) | Surface Mount (BGA) |
| Packaging | Tray | — |
| Logic Elements (LE) | — | 72,600 |
| Embedded Memory Bits | — | 7,564,880 (about 7.5 Mbit) |
| Embedded Memory Blocks | — | 72600 |
| Number of Logic Cells / Arrays | — | 372 |
| Number of User I/O Pins | — | 372 |
| Number of Transceiver Channels | — | [DATA_NEEDED: exact channel count for this device] |
| Transceiver Data Rate | — | [DATA_NEEDED: per-channel data rate] |
| Package Type | — | 780-Ball FCBGA (Fine-pitch Chip-Scale BGA, flip-chip) |
| Package Code | — | DF29 |
| Operating Temperature Grade | — | Industrial (I3) |
| Junction Temperature Range | — | -40C to +100C |
| MSL स्तर | — | [DATA_NEEDED: MSL rating] |
| RoHS स्थिति | — | Compliant |
| हैलोजन फ्री | — | [DATA_NEEDED: halogen-free claim] |