EPF10K200EBI600-2 vs EPF10K200SBC600-1 तुलना
विस्तृत दोनों ओर की तुलना EPF10K200EBI600-2 द्वारा Intel और EPF10K200SBC600-1 द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
Intel
EPF10K200EBI600-2 - FLEX 10KE FPGA 200K Gates 9984 LEs BGA-600 | Intel
EPF10K200EBI600-2 ObsoleteIntel
EPF10K200SBC600-1 - 200K Gate FLEX-10KS FPGA, 470 I/O | Intel / Altera
EPF10K200SBC600-1 Obsoleteविशेषता तुलना
| पैरामीटर | EPF10K200EBI600-2 | EPF10K200SBC600-1 |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | Obsolete | Obsolete |
| Family | FLEX 10KE | FLEX-10KS |
| System Gates | 200,000 | — |
| Logic Elements (LEs) | 9,984 | — |
| Logic Array Blocks (LABs) | 1,248 | 1,248 |
| Embedded RAM | 98,304 bits | — |
| Embedded Array Blocks (EABs) | 12 (typical for this density) | — |
| User I/O Pins | 470 | — |
| Supply Voltage (VCCINT) | 2.5 V | — |
| Propagation Delay | 0.4 ns (per -2 speed grade) | 0.4 ns |
| ऑपरेटिंग तापमान | 0 C to 70 C (commercial) | 0 °C to 70 °C (Commercial) |
| पैकेज | BGA-600, 45 x 45 mm, 1.27 mm pitch | 600-ball BGA, 45 × 45 mm, 1.27 mm pitch |
| Logic Family | CMOS, SRAM-based | — |
| माउंटिंग प्रकार | Surface Mount (BGA) | Surface Mount |
| Configuration Method | JTAG / ByteBlaster (SRAM configuration) | — |
| RoHS स्थिति | Compliant (lead-free package) | Non-compliant (per third-party listing) |
| Series | — | EPF10K200 |
| Logic Elements / Cells | — | 9,984 |
| Gate Count (typical) | — | 200,000 gates |
| Number of User I/Os | — | 470 |
| Number of Logic Cells | — | 4,992 |
| Embedded RAM (bits) | — | 24,576 (across EABs) |
| Max Internal Frequency | — | 250 MHz |
| Process Technology | — | 0.22 µm CMOS |
| Core Supply Voltage (VCCINT) | — | 2.375 V to 2.625 V (typ. 2.5 V) |
| Speed Grade | — | -1 (fastest commercial) |
| JTAG Support | — | IEEE Std 1149.1 |
| Configuration | — | Serial via EPC2/EPC8 configuration devices |