EPF10K30RI240-4N vs EPF10K130EQI240-2 तुलना
विस्तृत दोनों ओर की तुलना EPF10K30RI240-4N द्वारा Intel और EPF10K130EQI240-2 द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
Intel
EPF10K130EQI240-2 - FLEX 10KE FPGA, 130K Gates, 240-PQFP | Intel / Altera
EPF10K130EQI240-2 Obsoleteविशेषता तुलना
| पैरामीटर | EPF10K30RI240-4N | EPF10K130EQI240-2 |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | NRND | Obsolete |
| Family | FLEX 10K | FLEX 10KE (SRAM-based FPGA) |
| Series | FLEX-10K® | FLEX 10KE |
| Logic Elements / Cells | 1,728 | — |
| Total RAM Bits | 12,288 | 65536 |
| Number of LABs/CLBs | 216 | — |
| Number of Logic Elements per LAB | 8 | — |
| Typical Gate Count | 30,000 gates | — |
| User I/O Count | 189 | — |
| Voltage - Supply (VCCINT) | 5 V | — |
| Voltage - I/O (VCCIO) | 3.3 V or 5 V (MultiVolt) | — |
| Process Technology | 0.42 µm CMOS SRAM | — |
| Speed Grade | -4 | -2 |
| Maximum Internal Frequency | 125 MHz (typical, design-dependent) | — |
| पैकेज / केस | 240-BFQFP Exposed Pad (RQFP-240) | 240-BFQFP (PQFP-240) |
| माउंटिंग प्रकार | Surface Mount | Surface Mount (PQFP with gull-wing leads) |
| ऑपरेटिंग तापमान | 0 °C to +70 °C | -40C to +85C |
| Configuration Method | SRAM - serial via BitBlaster / ByteBlasterMV / Jam STAPL | — |
| JTAG (IEEE 1149.1) | Yes | — |
| PCI Clamping / Slew-Rate Control | Yes (per-pin, via Altera logic options) | — |
| RoHS स्थिति | [DATA_NEEDED: rohs status] | Compliant |
| Lead-Free / Halogen-Free | [DATA_NEEDED: lead-free / halogen-free] | — |
| Number of Logic Elements / Cells | — | 6656 |
| Number of LABs / CLBs | — | 832 |
| Typical Gates | — | 130000 |
| Maximum System Gates | — | 342000 |
| Number of User I/O | — | 186 |
| Number of Gates | — | 342000 |
| Voltage Supply | — | 5.0 V core, multi-volt I/O (5.0V / 3.3V / 2.5V) |
| Programmability Type | — | SRAM, in-system programmable via JTAG (IEEE 1149.1) |