RTAX4000D-CQ352B vs RTAX4000D-CQ352V तुलना

विस्तृत दोनों ओर की तुलना RTAX4000D-CQ352B द्वारा Microchip Technology और RTAX4000D-CQ352V द्वारा Microchip Technology. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。

Microchip Technology
RTAX4000D-CQ352B RTAX4000D-CQ352B - 4M-Gate Rad-Tolerant FPGA CQFP-352 | Microchip

RTAX4000D-CQ352B - 4M-Gate Rad-Tolerant FPGA CQFP-352 | Microchip

RTAX4000D-CQ352B ✓ सक्रिय
Microchip Technology
RTAX4000D-CQ352V RTAX4000D-CQ352V - 4M-Gate Rad-Tolerant FPGA | Microchip Technology

RTAX4000D-CQ352V - 4M-Gate Rad-Tolerant FPGA | Microchip Technology

RTAX4000D-CQ352V ✓ सक्रिय

विशेषता तुलना

पैरामीटर RTAX4000D-CQ352B RTAX4000D-CQ352V
ब्रांड Microchip Technology Microchip Technology
श्रेणी FPGA & CPLD FPGA & CPLD
लाइफसाइकिल स्थिति सक्रिय सक्रिय
Logic Cells 55,440 55,440
Configurable Logic Blocks (CLBs) 36,960 —
Equivalent Gates 4,000,000 —
System Gates (cells, per Jotrin listing) 33,600 —
Family RTAX-DSP (RTAX-S/SL/DSP) RTAX-S/SL and RTAX-DSP radiation-tolerant FPGAs
Process Technology 0.15 um —
Core Supply Voltage 1.5 V (1.425 V to 1.575 V) [DATA_NEEDED: core voltage]
Combinatorial CLB Delay [DATA_NEEDED: combinatorial CLB delay for standard speed grade; 0.99 ns max is specified for the -1 speed grade variant] —
Technology Type Antifuse, one-time programmable, radiation-tolerant —
पैकेज 352-pin Ceramic CQFP (CQFP-352) CQ352 ceramic column grid array
माउंटिंग प्रकार Surface Mount Surface Mount
Configuration Live at power-up, single chip, no external configuration memory —
Radiation Tolerance Radiation-tolerant (space-flight qualified family) [DATA_NEEDED: TID and SEE ratings]
Application Domain Space flight systems Space flight systems (radiation-tolerant)
Programmability OTP (one-time programmable antifuse) —
RoHS स्थिति [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
ऑपरेटिंग तापमान [DATA_NEEDED: operating temperature range] —
Equivalent System Gates — 4,000,000 gates
CLB Organization — 36,960 CLBs
Number of User I/Os — 166
Technology — Digital, CMOS
Programmability Type — Antifuse (OTP), live at power-up
Embedded Memory — Embedded SRAM with built-in FIFO control logic
Clocking — Segmentable clocks, chip-wide highway routing
Operating Temperature Min — -55 C
Operating Temperature Max — +125 C

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