XC7Z030-2FF676I - Dual Cortex-A9 Zynq-7000 SoC | AMD
MPN: XC7Z030-2FF676I ✓ सक्रियXC7Z030-2FF676I अवलोकन
A system-on-chip is an integrated semiconductor that combines a programmable logic device with one or more hard processors. In the Zynq-7000 hierarchy, the FPGA fabric belongs to the Kintex-7 family, while the processor subsystem uses dual Arm Cortex-A9 MPCore technology. This integration reduces the number of separate devices and interconnects required for a processor-plus-FPGA design, but software, power delivery, thermal management, and board-level validation remain substantial engineering tasks.
The XC7Z030 device provides 125K logic cells and an 800 MHz CPU according to the verified AMD and distributor listings. Its integrated 676-FCBGA package supports high-density connections among the programmable logic, processors, memory interfaces, and external I/O. The -2 designation identifies the device speed grade, while the final I suffix identifies the industrial-temperature ordering variant. Exact core voltage limits, memory data rates, transceiver capabilities, and detailed I/O characteristics must be confirmed in the AMD Zynq-7000 SoC datasheet and package documentation.
The integrated FPGA fabric can accelerate parallel workloads such as image preprocessing, protocol handling, sensor data acquisition, and deterministic control pipelines. The dual Cortex-A9 subsystem is better suited to operating systems, networking stacks, control software, and human-interface logic. Designers can assign workloads between software and programmable logic, although the exact partition depends on timing, memory bandwidth, power, and tool-flow constraints.
Typical applications include industrial machine vision, industrial automation controllers, networked embedded gateways, test and measurement systems, communications equipment, and high-performance embedded processing. In each case, the benefit comes from combining general-purpose Linux or bare-metal software with hardware parallelism in one device. A new design should still verify software support, memory-device compatibility, external clock requirements, and available board resources.
The primary design consideration is power delivery to a large FCBGA device. Multiple voltage rails, high-current paths, decoupling, thermal vias, controlled-impedance routing, and a multilayer PCB are normally required. Designers should not infer complete pin compatibility or performance from a distributor family listing without reviewing the AMD package pinout files and comparing every power, ground, and signal connection.
This page consolidates the verified package, processor, logic-cell, frequency, pricing, and sourcing information with engineering guidance and a transparent comparison of same-family alternatives. It also distinguishes verified facts from parameters that require confirmation from the manufacturer datasheet, helping engineers plan sourcing and design reviews before committing a new PCB.
के लिए ड्रॉप-इन विकल्प XC7Z030-2FF676I — समान पैकेज, पिन-टू-पिन संगत। PCB रीवर्क आवश्यक करने वाले भिन्न-पैकेज पार्ट्स शामिल नहीं हैं।
XC7Z030-2FBG676I
✅ ड्रॉप-इन📋 संदर्भ विकल्प (कैटलॉग में नहीं)
XC7Z030-2FBG676C
✅ ड्रॉप-इन📋 संदर्भ विकल्प (कैटलॉग में नहीं)
XC7Z030-2FFG676I
✅ ड्रॉप-इन📋 संदर्भ विकल्प (कैटलॉग में नहीं)
XC7Z030-1FBG676I
✅ ड्रॉप-इन📋 संदर्भ विकल्प (कैटलॉग में नहीं)
XC7Z030-2FF676I Maximum Ratings और Electrical Characteristics
| Device Type | Zynq-7000 system-on-chip with dual Arm Cortex-A9 MPCore and Kintex-7 FPGA |
| Processor Core Count | 2 Arm Cortex-A9 MPCore cores |
| Processor Architecture | Arm Cortex-A9 MPCore |
| Processor Frequency | 800 MHz |
| FPGA Family | Kintex-7 |
| Logic Cells | 125K logic cells |
| SoC Family | Zynq-7000 |
| पैकेज | 676-FCBGA (27 x 27 mm) |
| Package Pin Count | 676 pins |
| Device Speed Grade | -2 |
| Temperature Grade | I industrial-temperature ordering variant; exact temperature limits require datasheet confirmation |
| Programmable Logic | 125K Kintex-7 FPGA logic cells |
| Debug and Trace | CoreSight system-on-chip debug capability |
XC7Z030-2FF676I 676 pins पिन कॉन्फ़िगरेशन गाइड
XC7Z030-2FF676I (676 pins पैकेज) के लिए पिन कॉन्फ़िगरेशन। इस डिजिटल IC में GPIO, संचार इंटरफ़ेस (UART, SPI, I2C) और पावर पिन शामिल हैं। वैकल्पिक पिन फ़ंक्शन और कॉन्फ़िगरेशन विकल्पों के लिए निर्माता डेटाशीट देखें। एम्बेडेड सिस्टम डिज़ाइन और PCB लेआउट के लिए आवश्यक।
इसके लिए कोई विस्तृत pinout data उपलब्ध नहीं: XC7Z030-2FF676I.
देखें डेटाशीट पूर्ण पिन कॉन्फ़िगरेशन के लिए।
सामान्य अनुप्रयोग
XC7Z030-2FF676I के लिए उपयुक्त है 6 अनुप्रयोगs: Industrial Machine Vision, Industrial Automation and Motion Control, High-Speed Sensor Data Acquisition, Embedded Network Gateway, Test and Measurement Equipment, Communications and Protocol Processing.
Industrial Machine Vision
The XC7Z030-2FF676I fits industrial machine-vision controllers because its 125K Kintex-7 logic cells can implement parallel image acquisition, thresholding, filtering, and pixel-stream processing while the dual 800 MHz Cortex-A9 cores run camera control, networking, and diagnostics. This division of labor can reduce the burden placed on the processor software. The principal trade-off is PCB complexity: the 676-FCBGA requires a multilayer layout, multiple clean supply rails, dense escape routing, and a thermal design sized for the complete Zynq-7000 SoC.
अनुशंसित
Industrial Automation and Motion Control
The XC7Z030-2FF676I is suitable for industrial automation because its dual Cortex-A9 MPCore processors can execute real-time control, diagnostics, and communications software while the 125K-cell FPGA fabric handles timing-critical sequencing, encoder processing, or parallel I/O. The combination allows hardware logic and general-purpose software to operate without separate package-routing between two major devices. Design validation must still check the selected I-temperature variant against the ambient enclosure temperature, power rails, and industrial EMC requirements.
अनुशंसित
High-Speed Sensor Data Acquisition
The XC7Z030-2FF676I can consolidate sensor acquisition and processing by using its Kintex-7 FPGA fabric for parallel ADC interfaces, digital filtering, triggering, and buffer management. Its dual 800 MHz Arm Cortex-A9 cores are then available for calibration, data analysis, storage management, and network protocols. The FPGA portion operates concurrently with the processors, avoiding a separate acquisition FPGA and processor interface. Exact ADC rates and memory bandwidth must be checked against the AMD Zynq-7000 electrical specifications.
अनुशंसित
Embedded Network Gateway
The XC7Z030-2FF676I fits embedded gateways that need a Linux-capable processor and adaptable hardware acceleration in the same package. The dual 800 MHz Cortex-A9 subsystem can manage protocols, storage, security, and application traffic, while the 125K Kintex-7 fabric can accelerate packet handling, compression, encryption preprocessing, or custom interfaces. This can shorten the hardware path between network ingress and processing. The trade-off is a demanding BGA layout and the need to validate Linux support, PHY interfaces, memory topology, and thermal margins.
अनुशंसित
Test and Measurement Equipment
The XC7Z030-2FF676I is appropriate for modular test and measurement systems where flexible logic, real-time acquisition, and sophisticated instrument control coexist. The 125K Kintex-7 cells can implement counters, pattern engines, timing blocks, or signal conditioning, while the dual 800 MHz Cortex-A9 cores execute control software and instrument communication. This architecture supports a compact, reconfigurable instrument without separating FPGA and processor packages. Designers should confirm the required external memory, clocking, reference voltage, and trigger-I/O assignments in the package documentation.
अनुशंसित
Communications and Protocol Processing
The XC7Z030-2FF676I can accelerate communications functions by assigning packet framing, CRC generation, buffering, and low-latency filtering to the 125K-cell Kintex-7 fabric while the dual 800 MHz Cortex-A9 cores manage higher-level protocols and operating-system services. Hardware partitioning can improve throughput and make timing behavior more deterministic than software-only processing. A valid implementation requires matching external PHY and memory interfaces to the device's verified I/O resources and reviewing signal-integrity and clocking requirements for high-speed communication links.
अनुशंसित
अनुशंसित उत्पादों का सारांश
के लिए इंजीनियरिंग संदर्भ डेटा XC7Z030-2FF676I — तुलना, डिज़ाइन मार्गदर्शन और अनुपालन जानकारी।
चयन गाइड
विकल्पों के साथ तुलना
| पैरामीटर | यह उत्पाद | XC7Z030-2FBG676I | XC7Z030-2FBG676C | XC7Z030-2FFG676I | XC7Z030-1FBG676I |
|---|---|---|---|---|---|
| Package | 676-FCBGA (27 x 27 mm) | 676-FCBGA (27 x 27 mm) - same | 676-FCBGA (27 x 27 mm) - same | 676-FCBGA (27 x 27 mm) - same | 676-FCBGA (27 x 27 mm) - same |
| Brand | AMD | AMD | AMD | AMD | AMD |
| Device Type | Zynq-7000 SoC with dual Arm Cortex-A9 and Kintex-7 FPGA | Zynq-7000 SoC with dual Arm Cortex-A9 and Kintex-7 FPGA | Zynq-7000 SoC with dual Arm Cortex-A9 and Kintex-7 FPGA | Zynq-7000 SoC with dual Arm Cortex-A9 and Kintex-7 FPGA | Zynq-7000 SoC with dual Arm Cortex-A9 and Kintex-7 FPGA |
| Processor Cores | 2 Arm Cortex-A9 MPCore cores | 2 Arm Cortex-A9 MPCore cores | 2 Arm Cortex-A9 MPCore cores | 2 Arm Cortex-A9 MPCore cores | 2 Arm Cortex-A9 MPCore cores |
| Processor Frequency | 800 MHz | 800 MHz | 800 MHz | 800 MHz | 800 MHz |
| Logic Cells | 125K logic cells | 125K logic cells | 125K logic cells | 125K logic cells | 125K logic cells |
| Speed Grade | -2 | -2 | -2 | -2 | -1 |
| Ordering Temperature Designation | I | I | C | I | I |
मुख्य विशेषताएँ
- Processor and programmable logic integration (बनामXC7Z030-1FBG676I)
- Same-package resource continuity (बनामXC7Z030-2SBG485I)
- Industrial ordering designation (बनामXC7Z030-2FBG676C)
- Verified current sourcing information (बनामXC7Z030-2FBG676I)
डिज़ाइन नोट्स
Treat the 676-FCBGA as a multi-rail, high-current design point. Before assigning regulators and capacitors, download the AMD Zynq-7000 datasheet and package pinout files, separate core, auxiliary, and I/O supplies, and map every supply ball to its required voltage. Place local bulk and high-frequency decoupling directly beneath the relevant device balls using via-in-pad or via-adjacent construction where the package and assembly process allow. Verify steady-state and transient limits with the toolchain's power estimator rather than relying on a nominal regulator rating.
The 27 x 27 mm FCBGA can concentrate heat in a small junction area, especially when both processors and a large portion of the FPGA fabric are active. Use the manufacturer's power-estimation workflow for processor and FPGA utilization, then design the PCB with a thermal-via field, exposed-package interface, and an enclosure-appropriate heat-spreading path. Validate the worst-case ambient temperature with a thermal chamber or validated thermal model. Do not infer allowable power from the listed price, clock, or logic-cell count.
A replacement can only be considered drop-in after checking the full AMD package file, not just the 676-ball count. Compare power and ground assignments, decoupling recommendations, high-speed memory interfaces, clock inputs, configuration pins, and user I/O for every package-code variant. Use the manufacturer pinout ZIP and UG865 file-format guidance included in the verified sources, and record the package-code decision in the board-control drawing to prevent substitution errors during procurement.
Do not treat XC7Z030-2FF676I, XC7Z030-2FFG676I, and XC7Z030-2FBG676I as interchangeable solely because the verified listings show 125K logic cells, 800 MHz operation, and a 676-FCBGA package. Ordering suffixes can encode speed grade, temperature class, and package or lead-free information. Obtain the AMD ordering guide, compare every decoded field, and review the change-control record. If any electrical or thermal field differs, use the revised part in a new design or perform a complete schematic, layout, and timing review.
अनुपालन जानकारी
The supplied web data does not provide explicit compliance declarations for this exact ordering code. Package-code and suffix details must be checked against the manufacturer product page and current compliance documentation.
