XC7Z030-2FF676I - Dual Cortex-A9 Zynq-7000 SoC | AMD
部品番号: XC7Z030-2FF676I ✓ 生産中XC7Z030-2FF676I 概要
A system-on-chip is an integrated semiconductor that combines a programmable logic device with one or more hard processors. In the Zynq-7000 hierarchy, the FPGA fabric belongs to the Kintex-7 family, while the processor subsystem uses dual Arm Cortex-A9 MPCore technology. This integration reduces the number of separate devices and interconnects required for a processor-plus-FPGA design, but software, power delivery, thermal management, and board-level validation remain substantial engineering tasks.
The XC7Z030 device provides 125K logic cells and an 800 MHz CPU according to the verified AMD and distributor listings. Its integrated 676-FCBGA package supports high-density connections among the programmable logic, processors, memory interfaces, and external I/O. The -2 designation identifies the device speed grade, while the final I suffix identifies the industrial-temperature ordering variant. Exact core voltage limits, memory data rates, transceiver capabilities, and detailed I/O characteristics must be confirmed in the AMD Zynq-7000 SoC datasheet and package documentation.
The integrated FPGA fabric can accelerate parallel workloads such as image preprocessing, protocol handling, sensor data acquisition, and deterministic control pipelines. The dual Cortex-A9 subsystem is better suited to operating systems, networking stacks, control software, and human-interface logic. Designers can assign workloads between software and programmable logic, although the exact partition depends on timing, memory bandwidth, power, and tool-flow constraints.
Typical applications include industrial machine vision, industrial automation controllers, networked embedded gateways, test and measurement systems, communications equipment, and high-performance embedded processing. In each case, the benefit comes from combining general-purpose Linux or bare-metal software with hardware parallelism in one device. A new design should still verify software support, memory-device compatibility, external clock requirements, and available board resources.
The primary design consideration is power delivery to a large FCBGA device. Multiple voltage rails, high-current paths, decoupling, thermal vias, controlled-impedance routing, and a multilayer PCB are normally required. Designers should not infer complete pin compatibility or performance from a distributor family listing without reviewing the AMD package pinout files and comparing every power, ground, and signal connection.
This page consolidates the verified package, processor, logic-cell, frequency, pricing, and sourcing information with engineering guidance and a transparent comparison of same-family alternatives. It also distinguishes verified facts from parameters that require confirmation from the manufacturer datasheet, helping engineers plan sourcing and design reviews before committing a new PCB.
ドロップイン代替品: XC7Z030-2FF676I — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
XC7Z030-2FBG676I
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XC7Z030-2FBG676C
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XC7Z030-2FFG676I
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XC7Z030-1FBG676I
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XC7Z030-2FF676I 最大定格＆電気的特性
| Device Type | Zynq-7000 system-on-chip with dual Arm Cortex-A9 MPCore and Kintex-7 FPGA |
| Processor Core Count | 2 Arm Cortex-A9 MPCore cores |
| Processor Architecture | Arm Cortex-A9 MPCore |
| Processor Frequency | 800 MHz |
| FPGA Family | Kintex-7 |
| Logic Cells | 125K logic cells |
| SoC Family | Zynq-7000 |
| パッケージ | 676-FCBGA (27 x 27 mm) |
| Package Pin Count | 676 pins |
| Device Speed Grade | -2 |
| Temperature Grade | I industrial-temperature ordering variant; exact temperature limits require datasheet confirmation |
| Programmable Logic | 125K Kintex-7 FPGA logic cells |
| Debug and Trace | CoreSight system-on-chip debug capability |
XC7Z030-2FF676I 676 pins ピン配置ガイド
XC7Z030-2FF676I (676 pins パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: XC7Z030-2FF676I.
詳細は データシート をご参照ください。
主な用途
XC7Z030-2FF676I の用途: 6 件s: Industrial Machine Vision, Industrial Automation and Motion Control, High-Speed Sensor Data Acquisition, Embedded Network Gateway, Test and Measurement Equipment, Communications and Protocol Processing.
Industrial Machine Vision
The XC7Z030-2FF676I fits industrial machine-vision controllers because its 125K Kintex-7 logic cells can implement parallel image acquisition, thresholding, filtering, and pixel-stream processing while the dual 800 MHz Cortex-A9 cores run camera control, networking, and diagnostics. This division of labor can reduce the burden placed on the processor software. The principal trade-off is PCB complexity: the 676-FCBGA requires a multilayer layout, multiple clean supply rails, dense escape routing, and a thermal design sized for the complete Zynq-7000 SoC.
おすすめ
Industrial Automation and Motion Control
The XC7Z030-2FF676I is suitable for industrial automation because its dual Cortex-A9 MPCore processors can execute real-time control, diagnostics, and communications software while the 125K-cell FPGA fabric handles timing-critical sequencing, encoder processing, or parallel I/O. The combination allows hardware logic and general-purpose software to operate without separate package-routing between two major devices. Design validation must still check the selected I-temperature variant against the ambient enclosure temperature, power rails, and industrial EMC requirements.
おすすめ
High-Speed Sensor Data Acquisition
The XC7Z030-2FF676I can consolidate sensor acquisition and processing by using its Kintex-7 FPGA fabric for parallel ADC interfaces, digital filtering, triggering, and buffer management. Its dual 800 MHz Arm Cortex-A9 cores are then available for calibration, data analysis, storage management, and network protocols. The FPGA portion operates concurrently with the processors, avoiding a separate acquisition FPGA and processor interface. Exact ADC rates and memory bandwidth must be checked against the AMD Zynq-7000 electrical specifications.
おすすめ
Embedded Network Gateway
The XC7Z030-2FF676I fits embedded gateways that need a Linux-capable processor and adaptable hardware acceleration in the same package. The dual 800 MHz Cortex-A9 subsystem can manage protocols, storage, security, and application traffic, while the 125K Kintex-7 fabric can accelerate packet handling, compression, encryption preprocessing, or custom interfaces. This can shorten the hardware path between network ingress and processing. The trade-off is a demanding BGA layout and the need to validate Linux support, PHY interfaces, memory topology, and thermal margins.
おすすめ
Test and Measurement Equipment
The XC7Z030-2FF676I is appropriate for modular test and measurement systems where flexible logic, real-time acquisition, and sophisticated instrument control coexist. The 125K Kintex-7 cells can implement counters, pattern engines, timing blocks, or signal conditioning, while the dual 800 MHz Cortex-A9 cores execute control software and instrument communication. This architecture supports a compact, reconfigurable instrument without separating FPGA and processor packages. Designers should confirm the required external memory, clocking, reference voltage, and trigger-I/O assignments in the package documentation.
おすすめ
Communications and Protocol Processing
The XC7Z030-2FF676I can accelerate communications functions by assigning packet framing, CRC generation, buffering, and low-latency filtering to the 125K-cell Kintex-7 fabric while the dual 800 MHz Cortex-A9 cores manage higher-level protocols and operating-system services. Hardware partitioning can improve throughput and make timing behavior more deterministic than software-only processing. A valid implementation requires matching external PHY and memory interfaces to the device's verified I/O resources and reviewing signal-integrity and clocking requirements for high-speed communication links.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: XC7Z030-2FF676I — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | XC7Z030-2FBG676I | XC7Z030-2FBG676C | XC7Z030-2FFG676I | XC7Z030-1FBG676I |
|---|---|---|---|---|---|
| Package | 676-FCBGA (27 x 27 mm) | 676-FCBGA (27 x 27 mm) - same | 676-FCBGA (27 x 27 mm) - same | 676-FCBGA (27 x 27 mm) - same | 676-FCBGA (27 x 27 mm) - same |
| Brand | AMD | AMD | AMD | AMD | AMD |
| Device Type | Zynq-7000 SoC with dual Arm Cortex-A9 and Kintex-7 FPGA | Zynq-7000 SoC with dual Arm Cortex-A9 and Kintex-7 FPGA | Zynq-7000 SoC with dual Arm Cortex-A9 and Kintex-7 FPGA | Zynq-7000 SoC with dual Arm Cortex-A9 and Kintex-7 FPGA | Zynq-7000 SoC with dual Arm Cortex-A9 and Kintex-7 FPGA |
| Processor Cores | 2 Arm Cortex-A9 MPCore cores | 2 Arm Cortex-A9 MPCore cores | 2 Arm Cortex-A9 MPCore cores | 2 Arm Cortex-A9 MPCore cores | 2 Arm Cortex-A9 MPCore cores |
| Processor Frequency | 800 MHz | 800 MHz | 800 MHz | 800 MHz | 800 MHz |
| Logic Cells | 125K logic cells | 125K logic cells | 125K logic cells | 125K logic cells | 125K logic cells |
| Speed Grade | -2 | -2 | -2 | -2 | -1 |
| Ordering Temperature Designation | I | I | C | I | I |
主な差別化要因
- Processor and programmable logic integration （vs XC7Z030-1FBG676I)
- Same-package resource continuity （vs XC7Z030-2SBG485I)
- Industrial ordering designation （vs XC7Z030-2FBG676C)
- Verified current sourcing information （vs XC7Z030-2FBG676I)
設計ノート
Treat the 676-FCBGA as a multi-rail, high-current design point. Before assigning regulators and capacitors, download the AMD Zynq-7000 datasheet and package pinout files, separate core, auxiliary, and I/O supplies, and map every supply ball to its required voltage. Place local bulk and high-frequency decoupling directly beneath the relevant device balls using via-in-pad or via-adjacent construction where the package and assembly process allow. Verify steady-state and transient limits with the toolchain's power estimator rather than relying on a nominal regulator rating.
The 27 x 27 mm FCBGA can concentrate heat in a small junction area, especially when both processors and a large portion of the FPGA fabric are active. Use the manufacturer's power-estimation workflow for processor and FPGA utilization, then design the PCB with a thermal-via field, exposed-package interface, and an enclosure-appropriate heat-spreading path. Validate the worst-case ambient temperature with a thermal chamber or validated thermal model. Do not infer allowable power from the listed price, clock, or logic-cell count.
A replacement can only be considered drop-in after checking the full AMD package file, not just the 676-ball count. Compare power and ground assignments, decoupling recommendations, high-speed memory interfaces, clock inputs, configuration pins, and user I/O for every package-code variant. Use the manufacturer pinout ZIP and UG865 file-format guidance included in the verified sources, and record the package-code decision in the board-control drawing to prevent substitution errors during procurement.
Do not treat XC7Z030-2FF676I, XC7Z030-2FFG676I, and XC7Z030-2FBG676I as interchangeable solely because the verified listings show 125K logic cells, 800 MHz operation, and a 676-FCBGA package. Ordering suffixes can encode speed grade, temperature class, and package or lead-free information. Obtain the AMD ordering guide, compare every decoded field, and review the change-control record. If any electrical or thermal field differs, use the revised part in a new design or perform a complete schematic, layout, and timing review.
コンプライアンス情報
The supplied web data does not provide explicit compliance declarations for this exact ordering code. Package-code and suffix details must be checked against the manufacturer product page and current compliance documentation.
