XCKU3P-2FFVA676E Kintex UltraScale+ FPGA | AMD
MPN: XCKU3P-2FFVA676E ✓ सक्रियXCKU3P-2FFVA676E अवलोकन
A field-programmable gate array, or FPGA, is a semiconductor whose digital logic is configured after manufacture. Within the broader hierarchy, an FPGA is a programmable-logic IC and a member of the semiconductor family. Unlike a fixed-function application-specific integrated circuit, an FPGA can combine parallel processing, serial connectivity, memory interfaces, and dedicated hardware blocks in one device. The Kintex UltraScale+ family targets designs that require substantially more programmable logic than midrange devices while retaining high-speed serial capabilities.
The XCKU3P-2FFVA676E combines 355,950 logic cells with 20,340 configurable logic blocks and 304 I/O locations. Its FCBGA package supports dense board-level integration and is appropriate for sophisticated systems in which pin count, routing capacity, and processing throughput are central design constraints. The -2 ordering designation identifies the device speed option, while the FFVA676E suffix identifies the package and ordering characteristics. Detailed electrical limits, memory organization, and transceiver ratings must be confirmed in the AMD datasheet before schematic release.
Programmable resources make the device suitable for parallel datapaths, protocol bridging, real-time filtering, control processing, and hardware-assisted acceleration. The 304 I/O connections provide substantial board-level connectivity for control signals, memory interfaces, clocks, data buses, and high-speed links. Designers should allocate pins according to the UltraScale package pinout files and account for bank-specific supply requirements, reference routing, and high-speed layout constraints.
Typical uses include network-interface equipment, industrial imaging and control, test-and-measurement systems, storage controllers, communications infrastructure, and embedded signal-processing platforms. In each case, the FPGA can implement multiple time-critical functions in parallel, reducing reliance on separate programmable controllers or discrete logic devices.
The primary design consideration is package-level complexity. A 676-ball FCBGA demands careful escape routing, dense via structures, controlled impedance, clean power delivery, and assembly process capability. Use the AMD package pinout files and board-design guidance to validate every ball assignment, voltage rail, decoupling network, and high-speed interface before fabrication.
This product page consolidates the verified device identity, package, programmable-resource figures, compatible same-family ordering options, and practical implementation guidance. It helps engineers compare alternatives and plan a PCB without obscuring the essential distinction between a true pin-compatible option and a broader Kintex UltraScale+ equivalent.
के लिए ड्रॉप-इन विकल्प XCKU3P-2FFVA676E — समान पैकेज, पिन-टू-पिन संगत। PCB रीवर्क आवश्यक करने वाले भिन्न-पैकेज पार्ट्स शामिल नहीं हैं।
इस सीरीज़ के वेरिएंट
समान श्रृंखला के मॉडल जो ड्रॉप-इन संगत हैं XCKU3P-2FFVA676E (समान फॉर्म फैक्टर और फुटप्रिंट) — इसमें भिन्न Package, Device Type, Logic Cells, Temperature Grade, Mounting Type.
XCKU3P-2FFVB676E
✅ ड्रॉप-इनकीमत के लिए संपर्क करें
डेटाशीट देखें →XCKU3P-2FFVA676I
✅ ड्रॉप-इनकीमत के लिए संपर्क करें
डेटाशीट देखें →XCKU3P-1FFVB676E
✅ ड्रॉप-इनकीमत के लिए संपर्क करें
डेटाशीट देखें →XCKU3P-1FFVB676I
✅ ड्रॉप-इनकीमत के लिए संपर्क करें
डेटाशीट देखें →XCKU3P-1FFVA676E
✅ ड्रॉप-इनकीमत के लिए संपर्क करें
डेटाशीट देखें →XCKU3P-2FFVA676E Maximum Ratings और Electrical Characteristics
| Device Type | Kintex UltraScale+ FPGA |
| Logic Cells | 355,950 cells |
| Configurable Logic Blocks | 20,340 CLBs |
| Input/Output Connections | 304 I/O |
| Nominal Core Voltage | 0.85 V |
| पैकेज | 676-BBGA FCBGA |
| Programmable Logic Type | FPGA |
| Device Family | Kintex UltraScale+ |
| Speed Grade | -2 |
| Temperature Grade | Extended |
| माउंटिंग प्रकार | Surface mount |
XCKU3P-2FFVA676E 676-bbga fcbga पिन कॉन्फ़िगरेशन गाइड
XCKU3P-2FFVA676E (676-bbga fcbga पैकेज) के लिए पिन कॉन्फ़िगरेशन। इस डिजिटल IC में GPIO, संचार इंटरफ़ेस (UART, SPI, I2C) और पावर पिन शामिल हैं। वैकल्पिक पिन फ़ंक्शन और कॉन्फ़िगरेशन विकल्पों के लिए निर्माता डेटाशीट देखें। एम्बेडेड सिस्टम डिज़ाइन और PCB लेआउट के लिए आवश्यक।
इसके लिए कोई विस्तृत pinout data उपलब्ध नहीं: XCKU3P-2FFVA676E.
देखें डेटाशीट पूर्ण पिन कॉन्फ़िगरेशन के लिए।
सामान्य अनुप्रयोग
XCKU3P-2FFVA676E के लिए उपयुक्त है 6 अनुप्रयोगs: Network Packet Processing, Industrial Control and Automation, Test and Measurement Instrumentation, Storage and Data Center Controllers, Communications and High-Speed Interface Equipment, Machine Vision and Image Processing.
Network Packet Processing
The XCKU3P-2FFVA676E fits network packet-processing designs that need extensive parallel logic, high-speed connectivity, and substantial I/O capacity. Its 355,950 logic cells and 20,340 configurable logic blocks can support multiple parallel datapaths, classification engines, queues, and protocol functions within one FPGA. The 304 I/O connections provide room for control buses, status signals, clocks, and external memory interfaces. Place the device in a 676-BBGA FCBGA layout only after assigning high-speed pins through AMD's UltraScale package files and validating the required transceiver resources against the datasheet.
अनुशंसित
Industrial Control and Automation
Industrial controllers benefit from the XCKU3P-2FFVA676E's combination of 355,950 logic cells, 304 I/O connections, and parallel programmable resources. The device can coordinate motion sequencing, sensor conditioning logic, machine vision pre-processing, safety monitoring, and communication protocols without requiring several separate logic devices. Its nominal 0.85 V core makes careful multi-rail power planning essential, while the dense FCBGA package limits routing flexibility. Engineers should reserve adequate copper and via structures for power delivery and maintain signal integrity on clocks, interfaces, and expansion buses.
अनुशंसित
Test and Measurement Instrumentation
The XCKU3P-2FFVA676E is suitable for test-and-measurement instruments requiring concurrent acquisition, control, signal processing, and user-interface logic. Its 20,340 configurable logic blocks can implement parallel measurement channels and timing logic, while the 304 I/O positions support instrument control, data capture, and synchronization. The Kintex UltraScale+ architecture is also identified for DSP and high-speed connectivity use cases. Exact acquisition-channel counts, transceiver capabilities, and supported clock rates should be selected from the manufacturer datasheet, while PCB designers must plan controlled-impedance routing and a robust 676-ball escape structure.
अनुशंसित
Storage and Data Center Controllers
The XCKU3P-2FFVA676E can support storage controllers, data movers, protocol accelerators, and embedded data-processing systems that benefit from parallel FPGA execution. With 355,950 logic cells and 304 I/O connections, it can host multiple queues, descriptor engines, error-management paths, and interface logic concurrently. The -2 speed ordering option should be evaluated when control-path timing margin is important. Before committing to the 676-BBGA FCBGA footprint, confirm the required transceiver count, memory interfaces, clock domains, power rails, and package pin assignments in AMD's device and package documentation.
अनुशंसित
Communications and High-Speed Interface Equipment
The XCKU3P-2FFVA676E is appropriate for communications equipment requiring programmable logic, DSP, embedded memory, and high-speed connectivity in a single device. Its large programmable-resource count allows protocol engines, datapath logic, framing, and system control to coexist, while 304 I/O positions support external interfaces and status routing. The actual number of high-speed transceivers, maximum line rates, and reference-clock requirements must be confirmed in the AMD datasheet. PCB implementation requires exact ball assignment, differential-pair routing, reference-plane management, and compliance with the AMD 676-BBGA design guidance.
अनुशंसित
Machine Vision and Image Processing
The XCKU3P-2FFVA676E can support parallel image pipelines that combine sensor capture, preprocessing, feature extraction, and control in one FPGA. The 355,950 logic cells provide substantial capacity for pixel-parallel operations, while 20,340 configurable logic blocks support independent processing channels and pipeline stages. Its 304 I/O connections are useful for camera interfaces, trigger signals, storage, and external accelerators. The 676-BBGA FCBGA package demands high-density escape routing and assembly-capable PCB construction, and designers should verify dedicated video, DSP, and transceiver resources in the official device documentation.
अनुशंसित
अनुशंसित उत्पादों का सारांश
के लिए इंजीनियरिंग संदर्भ डेटा XCKU3P-2FFVA676E — तुलना, डिज़ाइन मार्गदर्शन और अनुपालन जानकारी।
चयन गाइड
विकल्पों के साथ तुलना
| पैरामीटर | यह उत्पाद | XCKU3P-2FFVB676E | XCKU3P-2FFVA676I | XCKU3P-1FFVB676E | XCKU3P-1FFVB676I | XCKU3P-1FFVA676E |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | 676-BBGA FCBGA | 676-BBGA FCBGA | 676-BBGA FCBGA | 676-BBGA FCBGA | 676-BBGA FCBGA | 676-BBGA FCBGA |
| Device Family | Kintex UltraScale+ | Kintex UltraScale+ | Kintex UltraScale+ | Kintex UltraScale+ | Kintex UltraScale+ | Kintex UltraScale+ |
| Nominal Core Voltage | 0.85 V | 0.85 V | 0.85 V | 0.85 V | 0.85 V | 0.85 V |
| Speed Grade | -2 | -2 | -2 | -1 | -1 | -1 |
| Temperature Ordering Code | E | E | I | E | I | E |
| Programmable Logic | FPGA | FPGA | FPGA | FPGA | FPGA | FPGA |
मुख्य विशेषताएँ
- Higher speed grade than the -1 alternatives (बनामXCKU3P-1FFVA676E)
- Extended-temperature ordering code (बनामXCKU3P-2FFVA676I)
- Substantial parallel programmable capacity (बनामXCKU3P-2FFVB676E)
डिज़ाइन नोट्स
Treat the 676-BBGA FCBGA footprint as a high-complexity routing problem. Use AMD's official package pinout files to assign every ball, preserve the specified ball map, and design layer transitions for the device's escape-routing requirements. Keep power and ground planes continuous where possible, use via arrays beneath dense pin fields, and verify the stackup, pad definition, solder-mask clearance, and assembly process with the fabricator before releasing artwork.
The device has a nominal 0.85 V core, but a complete design may require several supply rails. Follow the manufacturer power architecture for core, auxiliary, configuration, and high-speed-interface supplies. Place local bulk and high-frequency decoupling capacitors next to the relevant balls, provide a low-impedance distribution network, and verify startup sequencing, voltage tolerances, and power-up timing against the official datasheet.
Use the AMD package and board-design guidance for high-speed differential routing. Assign I/O and transceiver pins only from the official UltraScale package files, maintain continuous reference planes, control pair length and impedance, and account for connector and package transitions. If substituting a -1 speed-grade part, repeat static timing analysis because external interface timing margins and internal clocking requirements may change.
A large FPGA can dissipate substantial power in dense implementations even though its nominal core voltage is only 0.85 V. Spread high-activity logic across the device, avoid unnecessarily enabling unused resources, and provide a thermal strategy based on the actual design's switching activity. Estimate package heat rise from the selected power and thermal data, then verify it with board-level thermal analysis and temperature sensors where mission reliability requires them.
अनुपालन जानकारी
The available product records do not explicitly state RoHS, REACH, lead-free, halogen-free, or conflict-minerals status. The E temperature ordering code is not evidence of AEC-Q100 qualification.