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Rohm Expands India OSAT Ties for Power MOSFETs: What It Means for TOLL and TO-252 Sourcing

Rohm is outsourcing TOLL packaging to Tata Electronics and TO-252 packaging to Suchi Semicon, starting with legacy power MOSFETs while keeping wafer fab in-house.

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TL;DR — tiga kalimat

  • Rohm is outsourcing TOLL packaging to Tata Electronics and TO-252 packaging to Suchi Semicon for the Indian market. (S1)
  • First wave is legacy power MOSFETs at the new Indian OSATs, with qualification still at an early stage and thermal management flagged as critical. (S1)
  • Wafer fabrication and production control stay in-house; only the back-end outsourcing ratio is expected to rise over time. (S1)

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Rohm Expands India OSAT Ties for Power MOSFETs: What It Means for TOLL and TO-252 Sourcing — Semiconductor News news briefEditorial cover for a Semiconductor News brief. Power motif; headline "Rohm Expands India OSAT Ties for Power MOSFETs: What It Means for TOLL and TO-252 Sourcing". No reported key numbers on this brief, so no number strip is drawn. 1 cited source. A one-time entrance animation stops under reduced motion.SEMICONDUCTOR NEWS · NEWS BRIEFRohm Expands India OSAT Ties for PowerMOSFETs: What It Means for TOLL andTO-252 SourcingXAIPART
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Reported by EE Times on 2026-10-08. Summarized and analyzed by XAIPART Editorial.

What happened

Rohm Semiconductor is expanding outsourced semiconductor assembly and test (OSAT) activity in India, with Tata Electronics assigned TOLL packaging and Suchi Semicon assigned TO-252 packaging for the Indian market.S1 Managing director of Rohm Semiconductor India, Makoto Terada, said TOLL is widely used in two-wheelers, while TO-252 serves a customer base closer to four-wheelers.S1

The first wave is being qualified on existing, legacy products, not new designs, with power MOSFETs as the lead part type. The Indian OSATs are new to Rohm, and qualification of the Indian partners is still at an early stage, with Rohm's quality teams conducting site visits and running the same qualification flow it uses elsewhere.S1 Thermal management is described as a critical evaluation criterion.S1

Rohm has no current plan to move wafer fabrication out of its own fabs as part of the India strategy. Terada said the wafer process will stay in-house, while production control also stays internal and the outsourcing ratio may rise over time.S1 The decision on what to outsource is being driven by a mix of region, location, application, capital efficiency, capacity and supply chain considerations.S1

The India expansion builds on an existing back-end outsourcing footprint in ASEAN countries and China. Rohm has also folded Japanese manufacturing subsidiaries into a wafer-process company and an assembly company starting 2026-04-01, with LAPIS and the Shiga facilities to follow in 2027.S1 In 2026-05, Rohm agreed to sell Rohm Electronics Dalian to Dalian Chengyue Precision Components Industry for about 4.2 billion yen (about 27 million US dollars) and to outsource manufacturing at that site afterward.S1 Separately, Rohm plans to license TSMC's GaN process technology and transfer it to its Hamamatsu facility, targeting an end-to-end GaN production system by 2027.S1

MetricReported valueSource
Tata Electronics package scopeTOLL[S1]
Suchi Semicon package scopeTO-252[S1]
Lead product familyPower MOSFETs (legacy parts)[S1]
Wafer fab outsourcingNot planned under current India strategy[S1]
Rohm Electronics Dalian sale priceAbout 4.2 billion yen (~27 million US dollars)[S1]
GaN end-to-end production targetBy 2027 at Hamamatsu[S1]
Rohm FY ended 2026-03-31 net sales481.1 billion yen (~3 billion US dollars), up 7.3% YoY[S1]
Rohm FY ended 2026-03-31 net loss158.4 billion yen (~1 billion US dollars)[S1]
India production volume targetNot disclosed[S1]

Background timeline

  1. - Rohm and Toshiba agreed to use each other's production capacity for power devices. [S1]
  2. - Rohm began using TSMC's 650V GaN process. [S1]
  3. - Rohm launched an automotive GaN partnership with TSMC. [S1]
  4. - Mitsubishi Electric, Rohm and Toshiba signed an MOU to discuss merging power device and semiconductor businesses. [S1]
  5. - Folded Japanese manufacturing subsidiaries into a wafer-process company and an assembly company. [S1]
  6. - Agreed to sell Rohm Electronics Dalian and outsource manufacturing there afterward. [S1]
  7. - LAPIS and Shiga facilities scheduled to follow the same consolidation step. [S1]
  8. - Target for end-to-end GaN production system at Hamamatsu after TSMC process transfer. [S1]

XAIPART take

Technical impact

TOLL and TO-252 are mainstream discrete-power packages with well-understood thermal and board-level behaviour, so moving legacy power MOSFETs onto Indian OSAT lines is a low-risk starting point. XAIPART analysis: the bigger technical gate is the qualification result, not the package itself, since Rohm is explicitly running its existing quality flow and flagging thermal management as a critical evaluation item. Designers should expect any India-built TOLL or TO-252 MOSFETs to carry Rohm's standard datasheet limits, but should request country-of-assembly and OSAT-site traceability on incoming inspection until field data accumulates. XAIPART analysis

Market impact

Splitting TOLL to Tata and TO-252 to Suchi lets Rohm benchmark two OSATs in parallel without committing the full TO-252 portfolio to a single source. XAIPART analysis: for procurement, the more relevant signal is Terada's statement that the outsourcing ratio may increase over time, which points to a multi-year shift of back-end capacity toward India and away from the legacy ASEAN and China footprint. Buyers sourcing TOLL or TO-252 MOSFETs for two-wheeler and light four-wheeler programs should plan for dual-site qualification and watch for Rohm to widen package scope per partner once demand supports it. XAIPART analysis

Action

Qualify both Tata-packaged TOLL and Suchi-packaged TO-252 MOSFETs as second sources in parallel rather than picking one path. XAIPART analysis: include country-of-assembly and OSAT site in the part-number or label spec so a future Tata/Suchi split is auditable, and ask Rohm for the qualification status update before locking 2027 BOMs. For India-bound automotive programs, align with Rohm's PLI-driven local-content reporting from the design stage. XAIPART analysis

XAIPART Forecast

XAIPART expects that, if Indian OSAT qualification passes on Rohm legacy power MOSFETs by 2027-03-31, Rohm will assign at least one additional package family beyond TOLL and TO-252 to its Indian OSAT partners within 9 months of that date; if no second package family is announced by 2027-12-31 this forecast is wrong. XAIPART analysis

Facts are as reported by the cited source. The design-in, sourcing and forward-looking statements above are XAIPART's analysis, not the source's claims. India production volume target, the share of Rohm output that will eventually be packaged and tested in India, and the final partner-to-package allocation are not disclosed by the source and remain single-source commentary from one executive.

Corrections: none at publication. This brief will be updated with a timestamp if the source corrects its report.

Dated developments, extracted from this page's timeline (curated milestones = hollow markers).
Timeline of dated developmentsDated entries: 2023-01-01 - Rohm and Toshiba agreed to use e…; 2023-01-01 - Rohm began using TSMC's 650V GaN…; 2024-01-01 - Rohm launched an automotive GaN …; 2026-03-01 2026 - Mitsubishi Electric, Rohm a…; 2026-04-01 - Folded Japanese manufacturing su…; 2026-05-01 2026 - Agreed to sell Rohm Electro…; 2027-01-01 - LAPIS and Shiga facilities sched…; 2027-01-01 2027 - Target for end-to-end GaN p….2023-01-01- Rohm and Toshiba agreed to use e…2023-01-01- Rohm began using TSMC's 650V GaN…2024-01-01- Rohm launched an automotive GaN …2026-03-012026 - Mitsubishi Electric, Rohm a…2026-04-01- Folded Japanese manufacturing su…2026-05-012026 - Agreed to sell Rohm Electro…2027-01-01- LAPIS and Shiga facilities sched…2027-01-012027 - Target for end-to-end GaN p…

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XAIPART expects that, if Indian OSAT qualification passes on Rohm legacy power MOSFETs by 2027-03-31, Rohm will assign at least one additional package family beyond TOLL and TO-252 to its Indian OSAT partners within 9... no second package family is announced by 2027-12-31 Pending

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Cost pressure by dimension — composite stateDiverging bars for three dimensions around a zero midpoint. Input Cost has no reading; Supply Demand z -1.4711, notable; Fx Energy z 0.1754, neutral. Composite index -9.7, band neutral.0Input costno readingSupply/demandz −1.4711 · notable46 dFX & energyz +0.1754 · neutral5 dcomposite −9.7 · neutral−100 · −40 · −15 · 0 · +15 · +40 · +100
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Sumber

  1. Rohm Semiconductor Expands Back-End Chip Manufacturing Outsourcing — https://www.eetimes.com/rohm-semiconductor-expands-back-end-chip-manufacturing-outsourcing/ · rss · diakses

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