10AX115U2F45E2SG vs 10AX115U3F45E2LG Perbandingan
Perbandingan bersamaan detil 10AX115U2F45E2SG dari Intel dan 10AX115U3F45E2LG dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | 10AX115U2F45E2SG | 10AX115U3F45E2LG |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Arria 10 GX | Arria 10 |
| Logic Elements | 1,150,000 | 1,150,000 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory Bits | 68,857,560 | 68,857,856 |
| Embedded Memory Blocks | 2,134 M20K blocks (approx.) | — |
| DSP Blocks | 1,518 (variable-precision, hardened FP) | Variable-precision, 1.5 TFLOPs FP32 |
| User I/Os | 480 | — |
| Transceivers | Up to 24 (GX, 12.5 Gbps) | — |
| PCIe Hard IP | Gen3 x8 | Gen3 x8/x16 |
| Memory Interfaces | DDR4, QDR-IV, RLDRAM3 | DDR4, DDR3, QDR IV, RLDRAM 3 |
| Process Node | 20 nm | — |
| Speed Grade | 2 | U3 (medium-performance, transceiver-focused) |
| Temperature Grade | E2 (industrial) | — |
| Paket | 1932-ball FCBGA (45 mm) | — |
| Tipe Mounting | Surface Mount | Surface Mount (BGA) |
| Status RoHS | Compliant | Compliant |
| Configuration Memory | SRAM-based (volatile, requires config device) | — |
| Series | — | Arria 10 GX |
| User I/O Count | — | 480 |
| Package Code | — | F45 (45 × 45 mm FCBGA) |
| Package Type | — | 1932-ball FCBGA (Flip-Chip BGA) |
| Process Technology | — | 20 nm TSMC |
| Transceiver Data Rate | — | Up to 28.05 Gbps |
| Suhu Kerja | — | 0C to +100C (Industrial, E2 grade) |
| Configuration Method | — | SRAM-based, loaded via JTAG / AS / PS |
| Lead-Free / Halogen-Free | — | Yes / Yes |