10AX115U2F45E2SG vs 10AX115U3F45E2LG Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10AX115U2F45E2SG disebabkan oleh Intel dan 10AX115U3F45E2LG disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10AX115U2F45E2SG | 10AX115U3F45E2LG |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Arria 10 GX | Arria 10 |
| Logic Elements | 1,150,000 | 1,150,000 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory Bits | 68,857,560 | 68,857,856 |
| Embedded Memory Blocks | 2,134 M20K blocks (approx.) | — |
| DSP Blocks | 1,518 (variable-precision, hardened FP) | Variable-precision, 1.5 TFLOPs FP32 |
| User I/Os | 480 | — |
| Transceivers | Up to 24 (GX, 12.5 Gbps) | — |
| PCIe Hard IP | Gen3 x8 | Gen3 x8/x16 |
| Memory Interfaces | DDR4, QDR-IV, RLDRAM3 | DDR4, DDR3, QDR IV, RLDRAM 3 |
| Process Node | 20 nm | — |
| Speed Grade | 2 | U3 (medium-performance, transceiver-focused) |
| Temperature Grade | E2 (industrial) | — |
| Kemasan | 1932-ball FCBGA (45 mm) | — |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Status RoHS | Compliant | Compliant |
| Configuration Memory | SRAM-based (volatile, requires config device) | — |
| Series | — | Arria 10 GX |
| User I/O Count | — | 480 |
| Package Code | — | F45 (45 × 45 mm FCBGA) |
| Package Type | — | 1932-ball FCBGA (Flip-Chip BGA) |
| Process Technology | — | 20 nm TSMC |
| Transceiver Data Rate | — | Up to 28.05 Gbps |
| Suhu Operasi | — | 0C to +100C (Industrial, E2 grade) |
| Configuration Method | — | SRAM-based, loaded via JTAG / AS / PS |
| Lead-Free / Halogen-Free | — | Yes / Yes |