10M50DAF256C8G vs 10M50DCF256C8G Perbandingan
Perbandingan bersamaan detil 10M50DAF256C8G dari Intel dan 10M50DCF256C8G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | 10M50DAF256C8G | 10M50DCF256C8G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX 10 | MAX 10 |
| Logic Elements | 49,760 (50K) | — |
| Embedded Memory (bits) | 1,677,312 | — |
| User Flash (bits) | 1,677,312 | — |
| Maximum User I/Os | 178 | — |
| Multipliers (18x18) | 312 | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | — |
| On-chip ADC | 12-bit, 1 MSPS, single or dual supply | — |
| Process Technology | 55 nm | TSMC 55 nm embedded flash CMOS |
| Core Voltage | 1.2 V | 1.0 V (internal) |
| Configuration | Internal flash (non-volatile, instant-on) | — |
| Speed Grade | C8 (8 ns) | 8 |
| Temperature Grade | Commercial (0C to +85C) | Commercial (C suffix) |
| Paket | 256-ball FBGA (F256) | 256-pin FBGA (FBGA256), 17x17 mm |
| Tipe Mounting | Surface Mount | Surface Mount (BGA) |
| Status RoHS | Compliant | Compliant |
| Level MSL | 3 (per JEDEC J-STD-20) | — |
| Logic Elements (LE) | — | 50,000 |
| Embedded Memory | — | 1,677,312 bits (user flash) + 5,151 Kbits (M9K RAM) |
| User Flash Memory | — | 1,677,312 bits |
| DSP Blocks (18x18 Multipliers) | — | 172 |
| Maximum User I/O Pins | — | 178 |
| Hard ADC Blocks | — | 2 (12-bit, 1 MSPS) |
| I/O Bank Voltage | — | 2.5 V / 3.3 V (LVCMOS compatible) |
| Configuration Method | — | On-die non-volatile flash (instant-on); dual-boot supported |