10M50DAF484C7G vs 10M25DAF484C7G Perbandingan
Perbandingan bersamaan detil 10M50DAF484C7G dari Intel dan 10M25DAF484C7G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | 10M50DAF484C7G | 10M25DAF484C7G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Product Type | FPGA (Field-Programmable Gate Array) | — |
| Series | MAX 10 | MAX 10 |
| Logic Elements | 50,000 | — |
| Embedded Memory | 1,677,312 bits (approximately 1.6 Mbit) | — |
| Embedded 18x18 Multipliers | 312 | 66 |
| User Flash Memory | [DATA_NEEDED: user flash bits] | — |
| Number of User I/O | 360 | — |
| Tegangan Pemuat | 1.2 V core (VCCINT) | — |
| Paket | 484-ball FBGA (F484), 23 x 23 mm, 1.0 mm pitch | 484-BGA (F484) |
| Tipe Mounting | Surface Mount | Surface Mount (BGA) |
| Configuration Memory | Non-volatile embedded flash (dual-configuration) | — |
| PLLs | 2 | 4 general-purpose |
| Global Clock Networks | [DATA_NEEDED: global clocks count] | — |
| ADC | Integrated 12-bit SAR, up to 17 channels | — |
| Suhu Kerja | 0 C to +85 C (commercial grade, C7 speed) | 0C to +85C (commercial) |
| Process Technology | 55 nm embedded flash CMOS | — |
| Level MSL | 3 | — |
| Status RoHS | Compliant | Compliant |
| Logic Elements (LE) | — | 25,000 |
| Embedded Memory (M9K blocks) | — | 1,728 Kbit |
| User I/O Pins (max) | — | 360 |
| On-chip Configuration Flash | — | Dual-configuration (instant-on, remote update) |
| Hard IP: ADC | — | 12-bit, 1 MSPS, 16-channel (MAX 10 family) |
| Global Clocks | — | 20 |
| On-chip Temperature Sensor | — | Yes |
| Design Tool | — | Intel Quartus Prime (Lite / Standard / Pro) |