10M50DAF484C7G vs 10M25DAF484C7G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10M50DAF484C7G disebabkan oleh Intel dan 10M25DAF484C7G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10M50DAF484C7G | 10M25DAF484C7G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Product Type | FPGA (Field-Programmable Gate Array) | — |
| Series | MAX 10 | MAX 10 |
| Logic Elements | 50,000 | — |
| Embedded Memory | 1,677,312 bits (approximately 1.6 Mbit) | — |
| Embedded 18x18 Multipliers | 312 | 66 |
| User Flash Memory | [DATA_NEEDED: user flash bits] | — |
| Number of User I/O | 360 | — |
| Tegangan Pemberi Arus | 1.2 V core (VCCINT) | — |
| Kemasan | 484-ball FBGA (F484), 23 x 23 mm, 1.0 mm pitch | 484-BGA (F484) |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Configuration Memory | Non-volatile embedded flash (dual-configuration) | — |
| PLLs | 2 | 4 general-purpose |
| Global Clock Networks | [DATA_NEEDED: global clocks count] | — |
| ADC | Integrated 12-bit SAR, up to 17 channels | — |
| Suhu Operasi | 0 C to +85 C (commercial grade, C7 speed) | 0C to +85C (commercial) |
| Process Technology | 55 nm embedded flash CMOS | — |
| Aras MSL | 3 | — |
| Status RoHS | Compliant | Compliant |
| Logic Elements (LE) | — | 25,000 |
| Embedded Memory (M9K blocks) | — | 1,728 Kbit |
| User I/O Pins (max) | — | 360 |
| On-chip Configuration Flash | — | Dual-configuration (instant-on, remote update) |
| Hard IP: ADC | — | 12-bit, 1 MSPS, 16-channel (MAX 10 family) |
| Global Clocks | — | 20 |
| On-chip Temperature Sensor | — | Yes |
| Design Tool | — | Intel Quartus Prime (Lite / Standard / Pro) |