10M50DCF672C8G vs 10M50DAF672C7G Perbandingan
Perbandingan bersamaan detil 10M50DCF672C8G dari Intel dan 10M50DAF672C7G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | 10M50DCF672C8G | 10M50DAF672C7G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | MAX 10 | — |
| Family | MAX 10 FPGA | MAX 10 |
| Logic Elements (LE) | 50,000 | 50,000 |
| Embedded Memory (bits) | 1,677,312 | — |
| User Flash Memory (bits) | 1,677,312 | — |
| Maximum User I/O Pins | 500 | — |
| Paket | 672-BGA (FineLine BGA, FBGA-672) | 672-FBGA (F672) |
| Package Dimensions | 27 mm x 27 mm, 1.0 mm pitch | — |
| Speed Grade | C8 (commercial, 8 speed bin) | C7 |
| Suhu Kerja | 0C to +85C (commercial) | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Supply Voltage Core | [DATA_NEEDED: core voltage] | — |
| Configuration Method | On-chip non-volatile flash (instant-on) | — |
| Status RoHS | Compliant | Compliant |
| Level MSL | 3 | — |
| Logic Array Blocks (LAB) | — | 500 |
| Total Memory Bits | — | 1,677,312 |
| Embedded Memory | — | 1,638 Kbit |
| Process Technology | — | 55 nm |
| Core Voltage | — | 1.2 V |
| Package Code | — | BGA, Square, Ball |
| Number of Terminals | — | 672 |
| Configuration Memory | — | Dual-boot on-chip flash |
| Temperature Grade | — | Commercial (other) |
| Integrated ADC | — | Yes (12-bit, on-chip) |
| DSP Blocks | — | Yes |
| User I/O | — | [DATA_NEEDED: User I/O count] |