10M50DCF672C8G vs 10M50DAF672C7G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10M50DCF672C8G disebabkan oleh Intel dan 10M50DAF672C7G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10M50DCF672C8G | 10M50DAF672C7G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | MAX 10 | — |
| Family | MAX 10 FPGA | MAX 10 |
| Logic Elements (LE) | 50,000 | 50,000 |
| Embedded Memory (bits) | 1,677,312 | — |
| User Flash Memory (bits) | 1,677,312 | — |
| Maximum User I/O Pins | 500 | — |
| Kemasan | 672-BGA (FineLine BGA, FBGA-672) | 672-FBGA (F672) |
| Package Dimensions | 27 mm x 27 mm, 1.0 mm pitch | — |
| Speed Grade | C8 (commercial, 8 speed bin) | C7 |
| Suhu Operasi | 0C to +85C (commercial) | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Supply Voltage Core | [DATA_NEEDED: core voltage] | — |
| Configuration Method | On-chip non-volatile flash (instant-on) | — |
| Status RoHS | Compliant | Compliant |
| Aras MSL | 3 | — |
| Logic Array Blocks (LAB) | — | 500 |
| Total Memory Bits | — | 1,677,312 |
| Embedded Memory | — | 1,638 Kbit |
| Process Technology | — | 55 nm |
| Core Voltage | — | 1.2 V |
| Package Code | — | BGA, Square, Ball |
| Number of Terminals | — | 672 |
| Configuration Memory | — | Dual-boot on-chip flash |
| Temperature Grade | — | Commercial (other) |
| Integrated ADC | — | Yes (12-bit, on-chip) |
| DSP Blocks | — | Yes |
| User I/O | — | [DATA_NEEDED: User I/O count] |