5CSEBA6U19I7N vs 5CSEBA6U23I7LN Perbandingan
Perbandingan bersamaan detil 5CSEBA6U19I7N dari Intel dan 5CSEBA6U23I7LN dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
5CSEBA6U19I7N - Cyclone V SE SoC FPGA, 110K LE, Dual ARM Cortex-A9 800MHz | Intel
5CSEBA6U19I7N ✓ Aktif
Perbandingan Spesifikasi
| Parameter Umum | 5CSEBA6U19I7N | 5CSEBA6U23I7LN |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone V SE SoC FPGA | Cyclone V SE SoC FPGA |
| Series | 5CSEBA6 | — |
| Device Variant | 5CSEA6 (U19 package, 110K LE) | — |
| Logic Elements | 110,000 | 110,000 |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore | — |
| HPS Maximum Frequency | 800 MHz | — |
| Embedded Memory | 4.45 Mbits (M10K + MLAB) | — |
| Hard Memory Controller | DDR3, DDR3L, LPDDR2 | — |
| Transceivers | Up to 9 channels, 3.125 Gbps | — |
| DSP Blocks | 112 (18x18 multipliers) | [DATA_NEEDED: variable-precision DSP block count] |
| PLLs | 6 (FPGA) + 3 (HPS) | — |
| User I/O Banks | 8 | — |
| Maximum User I/O | 288 (package-dependent) | — |
| Paket | 484-pin UBGAFBGA (UBGA-484, 19x19 mm) | 672-pin UBGA (UBG-672) 23x23 mm |
| Suhu Kerja | -40C to +100C (Industrial) | — |
| Process Technology | TSMC 28 nm low-power | — |
| Tegangan Pemuat | Multi-rail (1.1 V core, 1.5/1.8/2.5/3.0/3.3 V I/O) | — |
| Configuration Modes | JTAG, Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP) | — |
| Status RoHS | Compliant | Compliant (lead-free suffix) |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount (BGA) |
| Processor Cores | — | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum CPU Clock | — | 925 MHz |
| Speed Grade | — | I7 (fast) |
| Temperature Range | — | Industrial (-40C to +100C junction) |
| Suffix L | — | Lead-free |
| Suffix N | — | Tray packaging |
| Hard Memory Blocks | — | [DATA_NEEDED: total M10K and MLAB bits] |
| HPS Peripherals | — | Gigabit Ethernet, USB 2.0 OTG, CAN, SPI, I2C, UART, SD/SDIO |
| Configuration Mode | — | JTAG and Active Serial (AS) |
| Process Node | — | TSMC 28 nm low-power |
| Design Toolchain | — | Intel Quartus Prime + SoC EDS |