A3PE3000L-FGG324 vs A3PE3000L-1FGG324I Perbandingan
Perbandingan bersamaan detil A3PE3000L-FGG324 dari Microchip Technology dan A3PE3000L-1FGG324I dari Microsemi. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Microchip Technology
A3PE3000L-FGG324 - ProASIC3L FPGA 3M Gates 221 I/O | Microchip
A3PE3000L-FGG324 ✓ AktifPerbandingan Spesifikasi
| Parameter Umum | A3PE3000L-FGG324 | A3PE3000L-1FGG324I |
|---|---|---|
| Merek | Microchip Technology | Microsemi |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Manufacturer Part Number | A3PE3000L-FGG324 | — |
| Family | ProASIC3L (Flash-based FPGA) | ProASIC3L |
| System Gates | 3,000,000 | 3000000 |
| Logic Cells (CLBs) | 75264 | — |
| User I/O | 221 | 221 |
| Configuration Memory | On-chip Flash (single-chip, nonvolatile) | — |
| Core Voltage Range | 1.2 V to 1.5 V | — |
| Tegangan Pemuat Kerja | 1.5 V | — |
| Maximum Operating Frequency | 250 MHz | — |
| Special Features | Flash*Freeze Technology, Schmitt Trigger inputs, weak pull-up/down | — |
| Boundary Scan | IEEE 1149.1 (JTAG) | — |
| Paket | 324-BGA / FBGA (FGG324) | 324-ball FBGA (FGG), 19 x 19 mm |
| Gaya Mounting | SMD/SMT | — |
| Suhu Kerja | 0 C to +70 C (commercial) | -40C to +125C (Industrial, I suffix) |
| Packaging | Tray | — |
| Embedded RAM | [DATA_NEEDED: embedded RAM capacity] | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS Status] |
| Logic Elements (Cells) | — | 75264 |
| Embedded RAM Bits | — | 516096 |
| Core Voltage | — | 1.2 V (1.2 V to 1.5 V range) |
| Process Technology | — | 130 nm flash |
| Speed Grade | — | -1 |
| Tipe Mounting | — | Surface Mount |
| Programming Technology | — | Nonvolatile Flash (Instant On, single chip) |
| Low Power Feature | — | Flash*Freeze Technology |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL Level] |
| Number of Logic Blocks (CLBs) | — | 75264 |