ATSAMA5D22B-CU vs ATSAMA5D225C-D1M-CU Perbandingan
Perbandingan bersamaan detil ATSAMA5D22B-CU dari Microchip Technology dan ATSAMA5D225C-D1M-CU dari Microchip Technology. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Microchip Technology
ATSAMA5D22B-CU - 500MHz ARM Cortex-A5 MPU, 196-TFBGA | Microchip
ATSAMA5D22B-CU ✓ AktifMicrochip Technology
ATSAMA5D225C-D1M-CU - 500MHz Cortex-A5 MPU w/ 128Mb DDR2 SiP | Microchip
ATSAMA5D225C-D1M-CU ✓ AktifPerbandingan Spesifikasi
| Parameter Umum | ATSAMA5D22B-CU | ATSAMA5D225C-D1M-CU |
|---|---|---|
| Merek | Microchip Technology | Microchip Technology |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | Aktif |
| Core Processor | ARM Cortex-A5 (32-bit, single core) | ARM Cortex-A5 |
| Core Architecture | ARMv7-A with TrustZone and NEON | — |
| Maximum CPU Clock | 500 MHz | 500 MHz |
| L1 Instruction Cache | 32 Kbytes | — |
| L1 Data Cache | 32 Kbytes | — |
| L2 Cache / SRAM | 128 Kbytes (configurable as internal SRAM) | — |
| Memory Architecture | MMU (full virtual memory support) | — |
| External Memory Support | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L (16-bit) | — |
| Flash Interfaces | 2x QSPI, e.MMC | — |
| Paket | 196-TFBGA (CSBGA), 11x11 mm, 0.8 mm pitch | 196-ball TFBGA 11x11 mm, 0.8 mm pitch |
| Tipe Mounting | Surface Mount | Surface Mount (BGA) |
| Suhu Kerja | -40 C to +85 C (industrial) | -40C to +85C (Industrial, IND TEMP) |
| Supply Voltage (core) | 1.2 V (typ, internal regulator) | — |
| Supply Voltage (I/O) | 3.3 V (typ) | — |
| Status RoHS | Compliant | Compliant (Green, lead-free) |
| Level MSL | [DATA_NEEDED: MSL level] | — |
| Lead-Free / Halogen-Free | Lead-free finish; halogen status [DATA_NEEDED] | — |
| Number of Cores | — | 1 Core, 32-Bit |
| Integrated DRAM | — | 128 Mbit DDR2 SDRAM (SiP) |
| ROM / Boot Code | — | 160 KB ROM |
| Graphics Acceleration | — | Yes (LCD controller up to WXGA 1366x768) |
| RAM Controllers | — | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI |
| Ethernet | — | 10/100/1000 GMAC |
| USB | — | 1x HSIC, 1x USB 2.0 HS Host/Device |
| CAN | — | CAN-FD |
| Security | — | Arm TrustZone, secure boot, tamper detection, AES/SHA/TRNG |
| Touch Controller | — | Peripheral Touch Controller (PTC) integrated |
| Audio | — | Embedded audio subsystem (I2S, Class-D amplifier) |
| Tegangan Pemuat | — | 1.2 V core (per typical SiP) |