ATSAMA5D22B-CU vs ATSAMA5D225C-D1M-CU 비교
다음의 상세 나란히 비교: ATSAMA5D22B-CU 제조: Microchip Technology 및 ATSAMA5D225C-D1M-CU 제조: Microchip Technology. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
Microchip Technology
ATSAMA5D22B-CU - 500MHz ARM Cortex-A5 MPU, 196-TFBGA | Microchip
ATSAMA5D22B-CU ✓ 활성Microchip Technology
ATSAMA5D225C-D1M-CU - 500MHz Cortex-A5 MPU w/ 128Mb DDR2 SiP | Microchip
ATSAMA5D225C-D1M-CU ✓ 활성사양 비교
| 파라미터 | ATSAMA5D22B-CU | ATSAMA5D225C-D1M-CU |
|---|---|---|
| 브랜드 | Microchip Technology | Microchip Technology |
| 카테고리 | Microcontrollers | Microcontrollers |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $10.75 | $12.60 |
| Core Processor | ARM Cortex-A5 (32-bit, single core) | ARM Cortex-A5 |
| Core Architecture | ARMv7-A with TrustZone and NEON | — |
| Maximum CPU Clock | 500 MHz | 500 MHz |
| L1 Instruction Cache | 32 Kbytes | — |
| L1 Data Cache | 32 Kbytes | — |
| L2 Cache / SRAM | 128 Kbytes (configurable as internal SRAM) | — |
| Memory Architecture | MMU (full virtual memory support) | — |
| External Memory Support | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L (16-bit) | — |
| Flash Interfaces | 2x QSPI, e.MMC | — |
| 패키지 | 196-TFBGA (CSBGA), 11x11 mm, 0.8 mm pitch | 196-ball TFBGA 11x11 mm, 0.8 mm pitch |
| 실장 유형 | Surface Mount | Surface Mount (BGA) |
| 동작 온도 | -40 C to +85 C (industrial) | -40C to +85C (Industrial, IND TEMP) |
| Supply Voltage (core) | 1.2 V (typ, internal regulator) | — |
| Supply Voltage (I/O) | 3.3 V (typ) | — |
| RoHS 상태 | Compliant | Compliant (Green, lead-free) |
| MSL 레벨 | [DATA_NEEDED: MSL level] | — |
| Lead-Free / Halogen-Free | Lead-free finish; halogen status [DATA_NEEDED] | — |
| Number of Cores | — | 1 Core, 32-Bit |
| Integrated DRAM | — | 128 Mbit DDR2 SDRAM (SiP) |
| ROM / Boot Code | — | 160 KB ROM |
| Graphics Acceleration | — | Yes (LCD controller up to WXGA 1366x768) |
| RAM Controllers | — | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI |
| Ethernet | — | 10/100/1000 GMAC |
| USB | — | 1x HSIC, 1x USB 2.0 HS Host/Device |
| CAN | — | CAN-FD |
| Security | — | Arm TrustZone, secure boot, tamper detection, AES/SHA/TRNG |
| Touch Controller | — | Peripheral Touch Controller (PTC) integrated |
| Audio | — | Embedded audio subsystem (I2S, Class-D amplifier) |
| 공급 전압 | — | 1.2 V core (per typical SiP) |