BSC9131NJN1HHHB557 vs BSC9131NLE7HHHB Perbandingan
Perbandingan bersamaan detil BSC9131NJN1HHHB557 dari NXP Semiconductors dan BSC9131NLE7HHHB dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | BSC9131NJN1HHHB557 | BSC9131NLE7HHHB |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | Akhir Hidup |
| Processor Type | QorIQ Qonverge multicore baseband processor | — |
| Processor Category | Embedded MPU / communications processor | — |
| Maximum Processor Frequency | 800 MHz | — |
| Package Type | 520-FCBGA | Flip-chip ball grid array |
| Ball Count | 520 balls | — |
| Package Technology | Flip-chip ball grid array | — |
| Tipe Mounting | Surface Mount | — |
| Core Count | [DATA_NEEDED: core count] | — |
| Memory Interface | [DATA_NEEDED: memory interface type and configuration] | — |
| Network and Serial Interfaces | [DATA_NEEDED: network and serial interface list] | — |
| Input Supply Voltage | [DATA_NEEDED: input supply voltage range] | — |
| I/O Voltage | [DATA_NEEDED: I/O voltage range] | — |
| Rentang Suhu Kerja | [DATA_NEEDED: operating temperature range] | — |
| Tahanan Panas | [DATA_NEEDED: thermal resistance] | — |
| Maximum Junction Temperature | [DATA_NEEDED: maximum junction temperature] | — |
| Physical Dimensions | [DATA_NEEDED: package dimensions] | — |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Status Lingkungan Hidup | Active; in-stock listing reported by LCSC | — |
| Manufacturer | NXP Semiconductors | — |
| Product Type | — | QorIQ Qonverge system-on-chip |
| General-Purpose Processor Core | — | 1 core |
| Processor Architecture | — | PowerPC e500 |
| Processor Word Size | — | 32 bit |
| e500 Core Frequency | — | 800 MHz |
| DSP Core | — | StarCore SC3850 |
| DSP Frequency | — | 800 MHz |
| Specialist Accelerator | — | MAPLE-B2F |
| External Memory Support | — | DDR3 |
| Security Feature | — | SEC |
| Paket | — | 520-FCBGA, 21 x 21 mm |
| Number of Package Balls | — | 520 balls |
| Suhu Kerja | — | 0°C to 105°C |
| Target Application 1 | — | Small-cell base station |
| Target Application 2 | — | Enterprise VoIP |
| Target Application 3 | — | Smart-grid control |
| Target Application 4 | — | Military and defense |
| Target Application 5 | — | Industrial applications |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification] |