BSC9131NJN1HHHB557 vs BSC9131NLE7HHHB Comparação
Comparação detalhada lado a lado de BSC9131NJN1HHHB557 por NXP Semiconductors e BSC9131NLE7HHHB por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | BSC9131NJN1HHHB557 | BSC9131NLE7HHHB |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Microcontrollers | Microcontrollers |
| Status do ciclo de vida | Ativo | Fim de vida |
| Processor Type | QorIQ Qonverge multicore baseband processor | — |
| Processor Category | Embedded MPU / communications processor | — |
| Maximum Processor Frequency | 800 MHz | — |
| Package Type | 520-FCBGA | Flip-chip ball grid array |
| Ball Count | 520 balls | — |
| Package Technology | Flip-chip ball grid array | — |
| Tipo de montagem | Surface Mount | — |
| Core Count | [DATA_NEEDED: core count] | — |
| Memory Interface | [DATA_NEEDED: memory interface type and configuration] | — |
| Network and Serial Interfaces | [DATA_NEEDED: network and serial interface list] | — |
| Input Supply Voltage | [DATA_NEEDED: input supply voltage range] | — |
| I/O Voltage | [DATA_NEEDED: I/O voltage range] | — |
| Faixa de temperatura de operação | [DATA_NEEDED: operating temperature range] | — |
| Resistência térmica | [DATA_NEEDED: thermal resistance] | — |
| Maximum Junction Temperature | [DATA_NEEDED: maximum junction temperature] | — |
| Physical Dimensions | [DATA_NEEDED: package dimensions] | — |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Status do ciclo de vida | Active; in-stock listing reported by LCSC | — |
| Manufacturer | NXP Semiconductors | — |
| Product Type | — | QorIQ Qonverge system-on-chip |
| General-Purpose Processor Core | — | 1 core |
| Processor Architecture | — | PowerPC e500 |
| Processor Word Size | — | 32 bit |
| e500 Core Frequency | — | 800 MHz |
| DSP Core | — | StarCore SC3850 |
| DSP Frequency | — | 800 MHz |
| Specialist Accelerator | — | MAPLE-B2F |
| External Memory Support | — | DDR3 |
| Security Feature | — | SEC |
| Encapsulamento | — | 520-FCBGA, 21 x 21 mm |
| Number of Package Balls | — | 520 balls |
| Temperatura de operação | — | 0°C to 105°C |
| Target Application 1 | — | Small-cell base station |
| Target Application 2 | — | Enterprise VoIP |
| Target Application 3 | — | Smart-grid control |
| Target Application 4 | — | Military and defense |
| Target Application 5 | — | Industrial applications |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification] |