DSP56F803BU80E vs SPAK56F803BU80 Perbandingan
Perbandingan bersamaan detil DSP56F803BU80E dari NXP Semiconductors dan SPAK56F803BU80 dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
DSP56F803BU80E - 16-bit DSC 80MHz 64KB Flash LQFP-100 | NXP
DSP56F803BU80E ✗ Akhir HidupNXP Semiconductors
SPAK56F803BU80 - DSP56F803 16-bit DSP, 80MHz, 100-LFQFP | NXP
SPAK56F803BU80 NrndPerbandingan Spesifikasi
| Parameter Umum | DSP56F803BU80E | SPAK56F803BU80 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | DSP | DSP |
| Status Lingkungan Hidup | Akhir Hidup | NRND |
| Core Processor | 56800 | — |
| Core Size | 16-bit | — |
| Series | 56F8xx | — |
| Frekuensi Bawah Maximum | 80 MHz | — |
| Performance | 40 MIPS (80MHz/40MIPS per Mouser) | — |
| Program Memory Size | 64 KB (32K x 16) | — |
| Program Memory Type | Flash | — |
| Architecture | Harvard-style, DSP + MCU hybrid | — |
| Connectivity | CANbus, EBI/EMI, SCI | — |
| Package Type | 100-LQFP (14x14 mm), LFQFP, square, gull wing | — |
| Number of Terminals | 100 | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Temperature Grade | Industrial | — |
| Packaging | Tray | — |
| Product Status | End of Life (EOL) per NXP product page | — |
| Tegangan Pemuat Kerja | [DATA_NEEDED: operating supply voltage] | — |
| Rentang Suhu Kerja | [DATA_NEEDED: operating temperature range] | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance status] |
| Product Type | — | 16-bit Digital Signal Processor |
| Core Architecture | — | DSP56F803 (DSP + MCU unified core) |
| Core Frequency | — | 80 MHz |
| Core Performance | — | 40 MIPS |
| Instruction Set | — | MCU-friendly DSP ISA with MAC, bit-manipulation unit, hardware DO/REP loops |
| Addressing Modes | — | 14 addressing modes |
| Program Memory | — | On-chip Flash (size [DATA_NEEDED: program memory size in KB]) |
| Data Memory | — | On-chip RAM (size [DATA_NEEDED: data memory size in KB]) |
| Paket | — | LFQFP-100 (Low-profile Fine-pitch QFP, gull-wing) |
| Package Outline | — | 100 terminals, square, gull-wing lead form |
| Operating Temperature Grade | — | Industrial |
| Manufacturer | — | NXP Semiconductors (formerly Freescale / Motorola) |
| Typical Applications | — | Motor control, power conversion, DSP signal processing, UPS, audio/sensor conditioning |