DSPA56371AF180 vs DSPB56371AF180 Perbandingan
Perbandingan bersamaan detil DSPA56371AF180 dari NXP Semiconductors dan DSPB56371AF180 dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
DSPB56371AF180 - 24-bit 180MHz Audio DSP | NXP | 80-LQFP
DSPB56371AF180 ✗ Akhir HidupPerbandingan Spesifikasi
| Parameter Umum | DSPA56371AF180 | DSPB56371AF180 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | DSP | DSP |
| Status Lingkungan Hidup | Aktif | Akhir Hidup |
| Product Type | Audio Digital Signal Processor (DSP) | Audio Digital Signal Processor (DSP), blank ROM version |
| Core Architecture | DSP56300 (24-bit fixed-point) | — |
| Core Clock Speed | 180 MHz | — |
| Throughput | 180 MIPS | — |
| Data Width | 24-bit | — |
| Instruction Word Width | 24-bit | — |
| Paket | 80-pin LQFP (LQFP-80) | — |
| Terminal Form | Gull Wing | Gull wing |
| Tipe Mounting | Surface Mount | Surface Mount |
| Package Code | QFP | QFP, square, quad gull-wing |
| Package Shape | Square | — |
| Peak Reflow Temperature | 260 C | — |
| Rentang Suhu Kerja | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: Operating Temperature Range] |
| Tegangan Pemuat | [DATA_NEEDED: core and I/O supply voltage] | [DATA_NEEDED: Supply Voltage] |
| On-chip Memory | [DATA_NEEDED: program/data RAM and ROM size] | — |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS Status] |
| Firmware Variant | Masked-ROM Symphony audio (A suffix) | — |
| Speed Grade | AF (180 MHz) | — |
| Core | — | DSP56300 24-bit fixed-point DSP core |
| Frekuensi Bawah Maximum | — | 180 MHz |
| Lebar Bus Data | — | 24 bit |
| Program Memory Type | — | ROM (customer-coded) |
| Target Applications | — | AV receivers, home theater, surround decoders, digital TV audio, automotive audio |
| Decoder Support | — | Dolby, THX, DTS (per NXP product page) |
| Package Type | — | 80-LQFP (14x14 mm) |
| Number of Terminals | — | 80 |
| Package Body Material | — | Plastic/Epoxy |
| On-Chip Memory (Program RAM/ROM) | — | [DATA_NEEDED: On-Chip Memory] |
| Status Lingkungan Hidup | — | End of Life (per NXP product page) |