EP1C12F324C8L vs EP1C12F324C8NGA Perbandingan
Perbandingan bersamaan detil EP1C12F324C8L dari Intel dan EP1C12F324C8NGA dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP1C12F324C8L | EP1C12F324C8NGA |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Waktu Pembelian Terakhir |
| Family | Cyclone | Cyclone I (EP1C12) |
| Logic Elements | 12,060 | — |
| Embedded RAM Bits | 239,616 | — |
| M4K RAM Blocks | 52 | — |
| User I/O Pins | 249 | — |
| PLLs | 2 | 2 |
| Paket | FBGA-324 | 324-BGA (FineLine BGA, 19 x 19 mm, 1.0 mm pitch) |
| Package Body Size | 19 x 19 mm | — |
| Ball Pitch | 1.0 mm | — |
| Speed Grade | 8 | 8 (commercial) |
| Core Voltage (VCCINT) | 1.5 V | 1.5 V |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) |
| Process Technology | CMOS, 130 nm | 0.13 µm SRAM |
| Suhu Kerja | 0C to +85C (commercial) | -40C to +85C (industrial) |
| Power Variant | Low-power (L suffix) | — |
| Status RoHS | Compliant | Compliant (lead-free) |
| Level MSL | [DATA_NEEDED: MSL level] | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount (BGA) |
| Series | — | Cyclone |
| Logic Elements (LE) | — | 12,060 |
| Total RAM Bits | — | 239,616 |
| Number of User I/O | — | 249 |
| Number of Logic Array Blocks (LAB) | — | 1,206 |
| Embedded 18x18 Multipliers | — | 52 |
| Configuration Mode | — | Passive Serial (PS), Active Serial (AS), JTAG |