EP1SGX25DF672I7 vs EP1SGX25DF672C7N Perbandingan

Perbandingan bersamaan detil EP1SGX25DF672I7 dari Intel dan EP1SGX25DF672C7N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Intel
EP1SGX25DF672C7N EP1SGX25DF672C7N - Stratix GX FPGA 25K LE 672-BGA | Intel / Altera

EP1SGX25DF672C7N - Stratix GX FPGA 25K LE 672-BGA | Intel / Altera

EP1SGX25DF672C7N ⚠ Waktu Beli Terakhir

Perbandingan Spesifikasi

Parameter Umum EP1SGX25DF672I7 EP1SGX25DF672C7N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Obsolete Waktu Pembelian Terakhir
Series Stratix GX Stratix GX
Family Stratix GX (EP1SGX25) —
Logic Elements 25,660 25,660
Configurable Logic Blocks (CLBs) 2,566 —
Total RAM Bits 1,944,576 —
Number of Logic Array Blocks (LABs) 455 —
Maximum Internal Clock Frequency 4385.97 MHz —
Combinatorial CLB Delay (max) 9.48 ns —
Process Technology CMOS 130 nm 130 nm CMOS
Nominal Supply Voltage 1.5 V —
Supply Voltage Range 1.425 V to 1.575 V —
Operating Temperature Grade MILITARY / Industrial —
Speed Grade I7 (slowest industrial) C7
Package Code DF (672-ball FC-FBGA) —
Number of Terminals 672 —
Terminal Form Ball (BGA) —
Package Shape Square —
Tipe Mounting Surface Mount (BGA) Surface Mount (BGA)
Status RoHS [DATA_NEEDED: RoHS status] Compliant
Embedded Memory — 1,944,576 bits
Maximum User I/O — 455
Number of Transceivers — 4
Transceiver Data Rate (Max) — 3.125 Gbps
Core Supply Voltage — 1.5 V
Suhu Kerja — 0 °C to 85 °C (Commercial)
Paket — 672-ball FineLine BGA (FBGA-672)
Package Dimensions — 33 × 33 mm, 1 mm pitch
Lead-Free / RoHS — Yes (lead-free, per datasheet)

Spek dan Sumber

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