EP1SGX25DF672I7 vs EP1SGX25DF672C7N Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP1SGX25DF672I7 disebabkan oleh Intel dan EP1SGX25DF672C7N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EP1SGX25DF672C7N EP1SGX25DF672C7N - Stratix GX FPGA 25K LE 672-BGA | Intel / Altera

EP1SGX25DF672C7N - Stratix GX FPGA 25K LE 672-BGA | Intel / Altera

EP1SGX25DF672C7N ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr EP1SGX25DF672I7 EP1SGX25DF672C7N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Obsolete Masa Terakhir Dibeli
Series Stratix GX Stratix GX
Family Stratix GX (EP1SGX25) —
Logic Elements 25,660 25,660
Configurable Logic Blocks (CLBs) 2,566 —
Total RAM Bits 1,944,576 —
Number of Logic Array Blocks (LABs) 455 —
Maximum Internal Clock Frequency 4385.97 MHz —
Combinatorial CLB Delay (max) 9.48 ns —
Process Technology CMOS 130 nm 130 nm CMOS
Nominal Supply Voltage 1.5 V —
Supply Voltage Range 1.425 V to 1.575 V —
Operating Temperature Grade MILITARY / Industrial —
Speed Grade I7 (slowest industrial) C7
Package Code DF (672-ball FC-FBGA) —
Number of Terminals 672 —
Terminal Form Ball (BGA) —
Package Shape Square —
Jenis Pemasangan Surface Mount (BGA) Surface Mount (BGA)
Status RoHS [DATA_NEEDED: RoHS status] Compliant
Embedded Memory — 1,944,576 bits
Maximum User I/O — 455
Number of Transceivers — 4
Transceiver Data Rate (Max) — 3.125 Gbps
Core Supply Voltage — 1.5 V
Suhu Operasi — 0 °C to 85 °C (Commercial)
Kemasan — 672-ball FineLine BGA (FBGA-672)
Package Dimensions — 33 × 33 mm, 1 mm pitch
Lead-Free / RoHS — Yes (lead-free, per datasheet)

Laporan Datasheet & Sumber

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