EP2A40B724C9 vs EP2A40B724C7 Perbandingan

Perbandingan bersamaan detil EP2A40B724C9 dari Altera dan EP2A40B724C7 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EP2A40B724C9 EP2A40B724C7
Merek Altera Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Obsolete Obsolete
Series APEX II —
Logic Elements (LE) 38,400 —
Embedded RAM Bits 655,360 (approximately 655 Kbits / 80 Kbytes) 655,360
Number of User I/O 540 —
Tegangan Pemuat Kerja 1.425 V to 1.575 V (core) —
MultiVolt I/O Support 1.5 V, 1.8 V, 2.5 V, 3.3 V 1.5 V, 1.8 V, 2.5 V, 3.3 V
Paket / Case 724-BBGA, FCBGA (Flip-Chip BGA) —
Supplier Device Package 724-BGA (35x35 mm) —
Tipe Mounting Surface Mount Surface Mount (BGA)
Suhu Kerja 0C to +85C 0 °C to +85 °C (commercial)
Shipping Medium Tray —
Level MSL [DATA_NEEDED: MSL level] [DATA_NEEDED: MSL level]
Status RoHS [DATA_NEEDED: RoHS status] Non-compliant (lead-bearing FCBGA)
Lead-Free [DATA_NEEDED: lead-free status] —
Architecture LUT-based with embedded memory blocks —
Typical Core Power [DATA_NEEDED: ICCDAT typical] —
Family — APEX II
Logic Elements / Cells — 38,400
Total System Gates — 1,500,000
Maximum User I/O — 540
Core Supply Voltage — 1.425 V to 1.575 V (typ. 1.5 V)
Process Technology — 0.15 µm CMOS, up to 8 metal layers, all-layer copper
Maximum Internal Frequency — 562 MHz
PLLs — 4
Paket — 724-ball FCBGA (FineLine BGA), 35 mm x 35 mm
I/O Standards Supported — LVTTL, LVCMOS, 1.5 V/1.8 V/2.5 V/3.3 V, SSTL, HSTL, PCI, LVDS, LVPECL, PCML, HyperTransport, True-LVDS (1 Gbps)
Configuration Method — JTAG (IEEE 1149.1), Passive Serial, Passive Parallel, Active Serial via EPC configuration devices
DDR Memory Support — Yes (via ESB / I/O circuitry)

Spek dan Sumber

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