EP2A40F1020I9N vs EP2A40F1020C8N Perbandingan
Perbandingan bersamaan detil EP2A40F1020I9N dari Intel dan EP2A40F1020C8N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP2A40F1020I9N | EP2A40F1020C8N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Obsolete |
| Family | APEX II | — |
| Device Logic Elements / Cells | 38,400 cells | — |
| System Gates | 1,500,000 (1.5 M) | — |
| Maximum Operating Frequency | 366 MHz | — |
| Process Technology | 0.15 um CMOS, up to 8 metal layers | — |
| Core Supply Voltage | 1.5 V | — |
| User I/O Count | 735 bidirectional I/O | — |
| Paket | 1020-pin FC-FBGA (Flip-Chip FineLine BGA) | — |
| Operating Temperature Grade | Industrial (I9 suffix: -40C to +100C per Altera APEX II convention) | — |
| High-Speed I/O Standards | True-LVDS (up to 1 Gbps), LVPECL, PCML, HyperTransport | — |
| Embedded Memory | ESB-based True-Dual-Port/Single-Port RAM, ROM, CAM (bits [DATA_NEEDED: total RAM bits]) | — |
| Clock Management | PLLs (count [DATA_NEEDED: PLL count]) | — |
| Configuration Modes | Passive Serial, Passive Parallel Asynchronous/Synchronous, JTAG | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Status RoHS | [DATA_NEEDED: RoHS status] | unknown |
| Status Lingkungan Hidup | Obsolete (per distributor listings / Altera APEX II family EOL) | — |
| Product Type | — | Field-Programmable Gate Array (FPGA) |
| Device Family | — | APEX II |
| Logic Technology | — | CMOS |
| Logic Gates | — | 1.5 million |
| Logic Cells | — | 38,400 |
| Nominal Supply Voltage | — | 1.5 V |
| Supply Voltage Range | — | 1.425 V to 1.575 V |
| User I/Os | — | 735 |
| Package Terminal Count | — | 1,020 pins |
| Package Type | — | FC-FBGA, BGA-1020 |
| Package Body Size | — | 33 mm x 33 mm |
| Ball Pitch | — | 1 mm |
| Reported Operating Frequency | — | 376 MHz |
| Alternative Reported Frequency | — | 562 MHz |
| Reported Propagation Delay | — | 1.78 ns |
| Alternative Reported Propagation Delay | — | 1.55 ns |
| Fabrication Process | — | 0.15 µm |
| Maximum Reported Metal Layers | — | 8 layers |
| Suhu Kerja | — | 0 °C to 85 °C |
| Terminal Form | — | Ball |
| REACH Status | — | unknown |
| AEC-Q100 Qualification | — | unknown |