EP2AGX125DF25C6G vs EP2AGX125DF25I3G Perbandingan
Perbandingan bersamaan detil EP2AGX125DF25C6G dari Intel dan EP2AGX125DF25I3G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EP2AGX125DF25I3G - 118K LE Arria II GX FPGA, 3.75Gbps, FC-FBGA | Intel
EP2AGX125DF25I3G ⚠ Waktu Beli TerakhirPerbandingan Spesifikasi
| Parameter Umum | EP2AGX125DF25C6G | EP2AGX125DF25I3G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Waktu Pembelian Terakhir |
| Series | Arria II GX | Arria II GX |
| Logic Elements (LEs) | 118,143 | — |
| Embedded Memory Bits | 8,315,904 | — |
| DSP Blocks (18x18 Multipliers) | 260 | — |
| Number of Logic Elements / Cells | 8315904 | — |
| Total RAM Bits | 8315904 | — |
| Paket | 572-BGA, FCBGA (HBGA) | 572-BGA, FCBGA (Flip-Chip FineLine BGA) |
| Tipe Mounting | Surface Mount | Surface Mount |
| Number of Terminals | 572 | — |
| Package Code | HBGA | — |
| Package Shape | Square | — |
| Form of Terminal | Ball | — |
| Suhu Kerja | [DATA_NEEDED: operating temperature range] | -40C to +100C (Industrial) |
| Speed Grade | C6 | — |
| Status RoHS | Compliant | Compliant |
| Logic Elements | — | 118,143 |
| Embedded Memory | — | 8,315,904 bits |
| Number of I/O | — | 260 |
| Core Voltage | — | 0.9 V |
| Process Technology | — | 40 nm |
| Maximum Operating Frequency | — | 500 MHz |
| Transceivers | — | Up to 12 (3.75 Gbps per channel) |
| Tegangan Pemuat | — | 0.9 V core |
| DSP Blocks | — | 18x18 multipliers |
| Level MSL | — | [DATA_NEEDED: MSL Level] |