EP2AGX125DF25C6G vs EP2AGX125DF25I3G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGX125DF25C6G sa pamamagitan ng Intel at EP2AGX125DF25I3G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2AGX125DF25I3G - 118K LE Arria II GX FPGA, 3.75Gbps, FC-FBGA | Intel
EP2AGX125DF25I3G ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP2AGX125DF25C6G | EP2AGX125DF25I3G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Huling Pagbili |
| Series | Arria II GX | Arria II GX |
| Logic Elements (LEs) | 118,143 | — |
| Embedded Memory Bits | 8,315,904 | — |
| DSP Blocks (18x18 Multipliers) | 260 | — |
| Number of Logic Elements / Cells | 8315904 | — |
| Total RAM Bits | 8315904 | — |
| Packhaging | 572-BGA, FCBGA (HBGA) | 572-BGA, FCBGA (Flip-Chip FineLine BGA) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Number of Terminals | 572 | — |
| Package Code | HBGA | — |
| Package Shape | Square | — |
| Form of Terminal | Ball | — |
| Temperature na Operasyon | [DATA_NEEDED: operating temperature range] | -40C to +100C (Industrial) |
| Speed Grade | C6 | — |
| Tindminan RoHS | Compliant | Compliant |
| Logic Elements | — | 118,143 |
| Embedded Memory | — | 8,315,904 bits |
| Number of I/O | — | 260 |
| Core Voltage | — | 0.9 V |
| Process Technology | — | 40 nm |
| Maximum Operating Frequency | — | 500 MHz |
| Transceivers | — | Up to 12 (3.75 Gbps per channel) |
| Volte ng Pagbibigay | — | 0.9 V core |
| DSP Blocks | — | 18x18 multipliers |
| Level ng MSL | — | [DATA_NEEDED: MSL Level] |