EP2AGX95EF35C6G vs EP2AGX95EF35I3G Perbandingan
Perbandingan bersamaan detil EP2AGX95EF35C6G dari Intel dan EP2AGX95EF35I3G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP2AGX95EF35C6G | EP2AGX95EF35I3G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Device Type | Field Programmable Gate Array (FPGA) | — |
| Product Family | Arria II GX | — |
| Logic Elements | 89,178 | 89,178 |
| Embedded Memory | 6,839,296 bits | — |
| User I/O | 452 | — |
| Paket | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA |
| Package Type | Ball Grid Array | — |
| Manufacturer | Altera / Intel | — |
| Core Voltage | [DATA_NEEDED: core voltage] | — |
| Suhu Kerja | [DATA_NEEDED: operating temperature] | -40C to +100C (Industrial) |
| Frekuensi Bawah Maximum | [DATA_NEEDED: maximum clock frequency] | — |
| Transceiver Count | [DATA_NEEDED: transceiver count] | Up to 12 channels |
| Transceiver Data Rate | [DATA_NEEDED: transceiver data rate] | — |
| Power Dissipation | [DATA_NEEDED: power dissipation] | — |
| Package Dimensions | [DATA_NEEDED: package dimensions] | — |
| Ball Pitch | [DATA_NEEDED: ball pitch] | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| Series | — | Arria II GX |
| Total RAM Bits | — | 6,839,296 |
| Number of LABs/CLBs | — | 452 |
| User I/O Count | — | 452 |
| Tipe Mounting | — | Surface Mount |
| Tegangan Pemuat | — | 0.9 V core, 1.1 V/1.2 V/1.5 V/1.8 V/2.5 V/3.0 V I/O |
| Max Transceiver Data Rate | — | 6.375 Gbps |
| DSP Blocks | — | 484 (18x18 multipliers) |
| Embedded Hard IP | — | PCI Express Gen1/Gen2 endpoint/root-port |
| Memory Interfaces | — | DDR3 SDRAM up to 800 Mbps, DDR2, QDR II+ |
| Process Technology | — | 40 nm TSMC |
| Level MSL | — | [DATA_NEEDED: MSL rating] |