EP2AGZ225FF35C3N vs EP2AGZ225FF35C4G Perbandingan
Perbandingan bersamaan detil EP2AGZ225FF35C3N dari Intel dan EP2AGZ225FF35C4G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP2AGZ225FF35C3N | EP2AGZ225FF35C4G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Aktif |
| Family | Arria II GZ | — |
| Logic Elements (LE) | 224,000 | — |
| Logic Array Blocks (LAB) | 8,960 | — |
| Embedded Memory (bits) | 14,248,960 | — |
| User I/Os | 554 | — |
| Paket | 1152-BBGA, FCBGA | 1152FBGA |
| Process Node | 40 nm | — |
| Speed Grade | 3 | — |
| Temperature Grade | Commercial (0C to +85C) | — |
| Transceivers | Up to 12.5 Gbps | [DATA_NEEDED: transceiver count] |
| DSP Blocks | Yes (variable-precision) | [DATA_NEEDED: DSP block count] |
| Memory Interfaces | DDR3, DDR2, QDRII+, RLDRAM2 | — |
| PCI Express Hard IP | Gen1, Gen2 | — |
| Tipe Mounting | Surface Mount (BGA) | — |
| Status RoHS | Compliant | unknown |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| Manufacturer | — | Intel |
| Product Family | — | FPGA |
| User I/O | — | 554 I/O |
| Package Type | — | Fine-pitch ball grid array |
| Logic Elements | — | [DATA_NEEDED: logic element count] |
| Embedded Memory | — | [DATA_NEEDED: embedded memory capacity] |
| Suhu Kerja | — | [DATA_NEEDED: operating temperature range] |
| Tegangan Pemuat | — | [DATA_NEEDED: supply voltage] |
| I/O Standards | — | [DATA_NEEDED: supported I/O standards] |
| Configuration Method | — | [DATA_NEEDED: configuration method] |
| REACH Status | — | unknown |
| AEC-Q100 Qualification | — | not_applicable |
| Lead-Free Status | — | unknown |
| Halogen-Free Status | — | unknown |