EP2AGZ225FF35C3N vs EP2AGZ225FF35C4G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2AGZ225FF35C3N disebabkan oleh Intel dan EP2AGZ225FF35C4G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2AGZ225FF35C3N | EP2AGZ225FF35C4G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Aktif |
| Family | Arria II GZ | — |
| Logic Elements (LE) | 224,000 | — |
| Logic Array Blocks (LAB) | 8,960 | — |
| Embedded Memory (bits) | 14,248,960 | — |
| User I/Os | 554 | — |
| Kemasan | 1152-BBGA, FCBGA | 1152FBGA |
| Process Node | 40 nm | — |
| Speed Grade | 3 | — |
| Temperature Grade | Commercial (0C to +85C) | — |
| Transceivers | Up to 12.5 Gbps | [DATA_NEEDED: transceiver count] |
| DSP Blocks | Yes (variable-precision) | [DATA_NEEDED: DSP block count] |
| Memory Interfaces | DDR3, DDR2, QDRII+, RLDRAM2 | — |
| PCI Express Hard IP | Gen1, Gen2 | — |
| Jenis Pemasangan | Surface Mount (BGA) | — |
| Status RoHS | Compliant | unknown |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| Manufacturer | — | Intel |
| Product Family | — | FPGA |
| User I/O | — | 554 I/O |
| Package Type | — | Fine-pitch ball grid array |
| Logic Elements | — | [DATA_NEEDED: logic element count] |
| Embedded Memory | — | [DATA_NEEDED: embedded memory capacity] |
| Suhu Operasi | — | [DATA_NEEDED: operating temperature range] |
| Tegangan Pemberi Arus | — | [DATA_NEEDED: supply voltage] |
| I/O Standards | — | [DATA_NEEDED: supported I/O standards] |
| Configuration Method | — | [DATA_NEEDED: configuration method] |
| REACH Status | — | unknown |
| AEC-Q100 Qualification | — | not_applicable |
| Lead-Free Status | — | unknown |
| Halogen-Free Status | — | unknown |