EP2AGZ225FF35I3G vs EP2AGZ225FF35C4G Perbandingan
Perbandingan bersamaan detil EP2AGZ225FF35I3G dari Intel dan EP2AGZ225FF35C4G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP2AGZ225FF35I3G | EP2AGZ225FF35C4G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Manufacturer | Intel (formerly Altera) | Intel |
| Series | Arria II GZ | — |
| Device Family | EP2AGZ | — |
| Logic Elements | 225,000 | [DATA_NEEDED: logic element count] |
| Paket | 1152-BGA (FBGA, FineLine BGA) | 1152FBGA |
| User I/O | 554 | 554 I/O |
| Transceivers | 12 channels | [DATA_NEEDED: transceiver count] |
| Max Transceiver Data Rate | 6.375 Gbps | — |
| Embedded Memory | 17.4 Mbits | [DATA_NEEDED: embedded memory capacity] |
| On-chip RAM | 1,152 Kbits | — |
| Embedded Multipliers | 1,728 18x18 | — |
| PLLs | 8 | — |
| DLLs | 8 | — |
| Process Technology | 40 nm TSMC | — |
| Core Voltage | 0.9 V | — |
| Suhu Kerja | -40C to +100C (Industrial) | [DATA_NEEDED: operating temperature range] |
| Speed Grade | I3 | — |
| Tipe Mounting | Surface Mount | — |
| Packaging | Tray | — |
| Status RoHS | Compliant | unknown |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| Product Family | — | FPGA |
| Package Type | — | Fine-pitch ball grid array |
| DSP Blocks | — | [DATA_NEEDED: DSP block count] |
| Tegangan Pemuat | — | [DATA_NEEDED: supply voltage] |
| I/O Standards | — | [DATA_NEEDED: supported I/O standards] |
| Configuration Method | — | [DATA_NEEDED: configuration method] |
| REACH Status | — | unknown |
| AEC-Q100 Qualification | — | not_applicable |
| Lead-Free Status | — | unknown |
| Halogen-Free Status | — | unknown |