EP2AGZ225FF35I3G vs EP2AGZ225FF35C4G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGZ225FF35I3G sa pamamagitan ng Intel at EP2AGZ225FF35C4G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGZ225FF35I3G | EP2AGZ225FF35C4G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Manufacturer | Intel (formerly Altera) | Intel |
| Series | Arria II GZ | — |
| Device Family | EP2AGZ | — |
| Logic Elements | 225,000 | [DATA_NEEDED: logic element count] |
| Packhaging | 1152-BGA (FBGA, FineLine BGA) | 1152FBGA |
| User I/O | 554 | 554 I/O |
| Transceivers | 12 channels | [DATA_NEEDED: transceiver count] |
| Max Transceiver Data Rate | 6.375 Gbps | — |
| Embedded Memory | 17.4 Mbits | [DATA_NEEDED: embedded memory capacity] |
| On-chip RAM | 1,152 Kbits | — |
| Embedded Multipliers | 1,728 18x18 | — |
| PLLs | 8 | — |
| DLLs | 8 | — |
| Process Technology | 40 nm TSMC | — |
| Core Voltage | 0.9 V | — |
| Temperature na Operasyon | -40C to +100C (Industrial) | [DATA_NEEDED: operating temperature range] |
| Speed Grade | I3 | — |
| Uri ng Pagpapasok | Surface Mount | — |
| Packaging | Tray | — |
| Tindminan RoHS | Compliant | unknown |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| Product Family | — | FPGA |
| Package Type | — | Fine-pitch ball grid array |
| DSP Blocks | — | [DATA_NEEDED: DSP block count] |
| Volte ng Pagbibigay | — | [DATA_NEEDED: supply voltage] |
| I/O Standards | — | [DATA_NEEDED: supported I/O standards] |
| Configuration Method | — | [DATA_NEEDED: configuration method] |
| REACH Status | — | unknown |
| AEC-Q100 Qualification | — | not_applicable |
| Lead-Free Status | — | unknown |
| Halogen-Free Status | — | unknown |