EP2AGZ300FF35I4 vs EP2AGZ300FF35C3G Perbandingan
Perbandingan bersamaan detil EP2AGZ300FF35I4 dari Intel dan EP2AGZ300FF35C3G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP2AGZ300FF35I4 | EP2AGZ300FF35C3G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Aktif |
| Family | Arria II GZ | — |
| Logic Elements | 298,000 | 300,000 |
| Configurable Logic Blocks (LABs/CLBs) | 11,920 | — |
| Maximum User I/O | 554 | — |
| Operating Frequency (Max) | 500 MHz | — |
| Process Technology | 40 nm | 40 nm TSMC |
| Core Voltage | 0.9 V | — |
| Paket | 1152-ball FC-FBGA (FF35) | FCBGA-1152 (35 mm) |
| Temperature Grade | Industrial (-40 C to +100 C) | Commercial (0 C to 85 C junction) |
| Number of Pins/Balls | 1152 | — |
| Terminal Form | Ball (BGA) | — |
| Transceivers | 12.5 Gbps integrated | 16 channels, up to 6.375 Gbps |
| Embedded Memory | M20K blocks (distributed) | 17,133 Kbit |
| DSP Blocks | Hard DSP columns (variable precision) | 16-bit x 18-bit x 18-bit multipliers, integer/fractional modes |
| PCIe Support | PCIe Gen2 hard IP | — |
| Tipe Mounting | Surface Mount (flip-chip BGA) | — |
| Status RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Series | — | Arria II GZ |
| Adaptive Logic Modules (ALMs) | — | 119,088 |
| Hard PCIe Controllers | — | Up to 12 (Gen2 endpoint/root-port) |
| User I/Os | — | 1,288 |
| I/O Banks | — | 12 |
| Package Family | — | BGA (Flip-Chip) |
| Speed Grade | — | 3 (mid-performance) |
| Configuration Method | — | Quartus II/Prime, JTAG, Passive Serial, Fast Passive Parallel |
| Hard Memory Controller | — | DDR3 up to 800 MHz, DDR2, QDR II+ |