EP2AGZ300HF40I4 vs EP2AGZ300HF40I3G Perbandingan
Perbandingan bersamaan detil EP2AGZ300HF40I4 dari Intel dan EP2AGZ300HF40I3G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP2AGZ300HF40I4 | EP2AGZ300HF40I3G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Arria II GZ | Arria II GZ |
| Family | Field-Programmable Gate Array (FPGA) | — |
| Manufacturer | Intel (formerly Altera) | — |
| Process Node | 40 nm | — |
| Logic Elements | 298,000 | 300,000 (approx.) |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory | 18,854,912 bits (18.85 Mbit) | 20.475 Mbits |
| Block RAM | 19,200 Kbits | — |
| Number of Logic Cells | 298,000 | — |
| Maximum User I/O Pins | 1192 | — |
| Number of Transceivers | Up to 24 | — |
| Transceiver Data Rate (max) | 6.375 Gbps (CPRI/OBSAI) | — |
| Number of PLLs | 8 | — |
| Core Voltage | 0.9 V (1.1 V option via SmartVoltage IDM) | 1.2 V (typical) |
| Core Performance (max) | 500 MHz | — |
| Number of Global Clock Networks | 16 | — |
| Package Type | 1517-ball FC-FBGA | — |
| Operating Temperature Grade | Industrial (I4): -40C to +100C | — |
| Tipe Mounting | Surface Mount (Flip-Chip BGA) | Surface Mount (BGA) |
| Status RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Embedded Multipliers | — | 28 (18x18) |
| User I/O Pins | — | 734 |
| Transceiver Count | — | 24 |
| Transceiver Data Rate | — | up to 6.375 Gbps |
| Process Technology | — | 40 nm TSMC |
| Paket | — | FBGA-1517 (HF40), 45 mm body, 1 mm pitch |
| Suhu Kerja | — | -40C to +100C (industrial) |
| PLL Count | — | [DATA_NEEDED: PLL count] |
| Level MSL | — | 3 |