EP2AGZ300HF40I4 vs EP2AGZ300HF40I3G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGZ300HF40I4 sa pamamagitan ng Intel at EP2AGZ300HF40I3G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGZ300HF40I4 | EP2AGZ300HF40I3G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Arria II GZ | Arria II GZ |
| Family | Field-Programmable Gate Array (FPGA) | — |
| Manufacturer | Intel (formerly Altera) | — |
| Process Node | 40 nm | — |
| Logic Elements | 298,000 | 300,000 (approx.) |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory | 18,854,912 bits (18.85 Mbit) | 20.475 Mbits |
| Block RAM | 19,200 Kbits | — |
| Number of Logic Cells | 298,000 | — |
| Maximum User I/O Pins | 1192 | — |
| Number of Transceivers | Up to 24 | — |
| Transceiver Data Rate (max) | 6.375 Gbps (CPRI/OBSAI) | — |
| Number of PLLs | 8 | — |
| Core Voltage | 0.9 V (1.1 V option via SmartVoltage IDM) | 1.2 V (typical) |
| Core Performance (max) | 500 MHz | — |
| Number of Global Clock Networks | 16 | — |
| Package Type | 1517-ball FC-FBGA | — |
| Operating Temperature Grade | Industrial (I4): -40C to +100C | — |
| Uri ng Pagpapasok | Surface Mount (Flip-Chip BGA) | Surface Mount (BGA) |
| Tindminan RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Embedded Multipliers | — | 28 (18x18) |
| User I/O Pins | — | 734 |
| Transceiver Count | — | 24 |
| Transceiver Data Rate | — | up to 6.375 Gbps |
| Process Technology | — | 40 nm TSMC |
| Packhaging | — | FBGA-1517 (HF40), 45 mm body, 1 mm pitch |
| Temperature na Operasyon | — | -40C to +100C (industrial) |
| PLL Count | — | [DATA_NEEDED: PLL count] |
| Level ng MSL | — | 3 |