EP2C8F256I8N vs EP2C5F256I8 Perbandingan
Perbandingan bersamaan detil EP2C8F256I8N dari Intel dan EP2C5F256I8 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP2C8F256I8N | EP2C5F256I8 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Aktif |
| Series | Cyclone II | — |
| Logic Elements (LEs) | 8,256 | — |
| Embedded Memory Bits | 165,888 bits | — |
| Total RAM Bits | 165,888 | 119,808 |
| Logic Blocks / Logic Cells | 540 (Logic Cells) | — |
| User I/O Pins | 182 | — |
| Number of LABs/CLBs | [DATA_NEEDED: LAB count] | — |
| Embedded 18x18 Multipliers | Up to 36 | — |
| PLLs | 2 | — |
| Global Clock Networks | 16 | — |
| Core Supply Voltage | 1.2 V | — |
| I/O Supply Voltage | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) | — |
| Process Technology | 90 nm CMOS (SRAM-based) | 90 nm CMOS, 1.2 V core |
| Package Type | 256-LBGA (FineLine BGA), 17x17 mm, 1.0 mm pitch | — |
| Suhu Kerja | -40C to +85C (industrial) | -40 °C to +100 °C (industrial) |
| Configuration Method | SRAM, loaded from external EPCS flash at power-up | — |
| Status RoHS | Compliant (Pb-free, lead-free reflow compatible) | Compliant |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount (BGA) |
| Family | — | Cyclone II |
| Logic Elements (LE) | — | 4,608 |
| Configurable Logic Blocks (CLB) | — | 288 |
| Embedded Memory (M4K blocks) | — | 250 kbit |
| Maximum User I/O | — | 158 |
| Paket | — | 256-ball FBGA (FineLine BGA) |
| Supply Voltage - Core (VCCINT) | — | 1.2 V |
| Supply Voltage - I/O (VCCIO) | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) |
| Speed Grade | — | I8 (industrial, 8 ns pin-to-pin) |
| PLL Count | — | Up to 4 |
| Embedded Multipliers (18×18) | — | Yes (DSP blocks) |
| Configuration Modes | — | AS, PS, FPP, JTAG |
| Level MSL | — | 3 |