EP2C8F256I8N vs EP2C5F256I8 比較
詳細並排比較 EP2C8F256I8N 由 Intel 與 EP2C5F256I8 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP2C8F256I8N | EP2C5F256I8 |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | NRND | 啟用中 |
| Series | Cyclone II | — |
| Logic Elements (LEs) | 8,256 | — |
| Embedded Memory Bits | 165,888 bits | — |
| Total RAM Bits | 165,888 | 119,808 |
| Logic Blocks / Logic Cells | 540 (Logic Cells) | — |
| User I/O Pins | 182 | — |
| Number of LABs/CLBs | [DATA_NEEDED: LAB count] | — |
| Embedded 18x18 Multipliers | Up to 36 | — |
| PLLs | 2 | — |
| Global Clock Networks | 16 | — |
| Core Supply Voltage | 1.2 V | — |
| I/O Supply Voltage | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) | — |
| Process Technology | 90 nm CMOS (SRAM-based) | 90 nm CMOS, 1.2 V core |
| Package Type | 256-LBGA (FineLine BGA), 17x17 mm, 1.0 mm pitch | — |
| 工作溫度 | -40C to +85C (industrial) | -40 °C to +100 °C (industrial) |
| Configuration Method | SRAM, loaded from external EPCS flash at power-up | — |
| RoHS 狀態 | Compliant (Pb-free, lead-free reflow compatible) | Compliant |
| 安裝類型 | Surface Mount (BGA) | Surface Mount (BGA) |
| Family | — | Cyclone II |
| Logic Elements (LE) | — | 4,608 |
| Configurable Logic Blocks (CLB) | — | 288 |
| Embedded Memory (M4K blocks) | — | 250 kbit |
| Maximum User I/O | — | 158 |
| 封裝 | — | 256-ball FBGA (FineLine BGA) |
| Supply Voltage - Core (VCCINT) | — | 1.2 V |
| Supply Voltage - I/O (VCCIO) | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) |
| Speed Grade | — | I8 (industrial, 8 ns pin-to-pin) |
| PLL Count | — | Up to 4 |
| Embedded Multipliers (18×18) | — | Yes (DSP blocks) |
| Configuration Modes | — | AS, PS, FPP, JTAG |
| MSL 等級 | — | 3 |